Methods of manufacturing devices for static and dynamic body measurements

ABSTRACT

A method of fabricating a sensor for static and dynamic body measurements, comprising providing a first layer serving as a flexible support material; disposing a second layer on the first layer, the second layer serving as a sensing material; disposing a third layer on the second layer, the third layer comprising an insulating material; coupling the second layer and the third layer using a first electrode comprising a first conductive thread and a first non-conductive thread, the first conductive thread embedded in the second layer; and coupling the first layer and the second layer using a second electrode comprising a second conductive thread and a second non-conductive thread, the second conductive thread embedded in the second layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of and claims the benefit of priorityto U.S. Ser. No. 16/237,314, filed on Dec. 31, 2018 and entitled“SYSTEMS, METHODS, AND DEVICES FOR STATIC AND DYNAMIC BODYMEASUREMENTS,” which itself is a non-provisional of and claims thebenefit of priority to U.S. Ser. No. 62/622,845, filed on Jan. 27, 2018and entitled “Design, fabrication, and use of wearable sensors andcontrollers in the shoe to monitor, analyze, and assist in gait andother bodily movements,” and to U.S. Ser. No. 62/695,004, filed on Jul.7, 2018 and entitled “Design, fabrication, and use of wearable sensorsfor body movement and machine learning applications,” the entiredisclosures of all of which are incorporated by reference in theirentireties herein.

BACKGROUND OF THE INVENTION

The present discussion includes background that might be helpful tounderstanding the present invention, but may not constitute prior art.

Sensors represent devices that are used to collect data about theenvironment, and accordingly may be used in numerous everyday objects.In various aspects, sensors may be of various types including electronicdevices, electromechanical devices, electro-optical devices, and thelike. Moreover, advances in micromachinery and microcontroller platformshas led to the increase use of sensors in determining a variety ofenvironmental variables including temperature, pressure, and flow.

Pressure sensitive sensors have a wide range of applications inindustry, sports, and medicine primarily due to their ease of use,relatively simple construction, and direct input-to-output sensingmechanism. Current construction primarily focuses on force sensitiveresistors (FSRs), where a material's resistance changes as a function ofapplied force. Other methods include capacitive/inductive touch, strainresistance, infrared and optical methods, to name a few. However, FSRshave become the preferred sensing modality because construction isrelatively cheap, easy, and industrially accessible; however, thelargest constraint for sports and health-care application is designingcustom and tunable form-factors that can fit into complex geometries andshapes. More so, pressure sensitive sensors need to tolerate excessiveuse if designed for the human body, and more so, comfortably fit into auser's clothing or seamlessly contact the skin without causing pain,discomfort, or unnecessary disturbances.

It is against this background that the present invention was developed.

BRIEF SUMMARY OF THE INVENTION

The following presents a summary to provide a basic understanding of oneor more embodiments of the disclosure. This summary is not intended toidentify key or critical elements, or to delineate any scope ofparticular embodiments or any scope of the claims. Its sole purpose isto present concepts in a simplified form as a prelude to the moredetailed description that is presented later. In one or more embodimentsdescribed herein are systems, methods, and apparatuses that describevarious aspects of static and dynamic body measurements.

According to one embodiment, a device for static and dynamic bodymeasurements is provided. The device may include a sensor, which mayfurther include a first layer serving as a flexible support material; asecond layer on the first layer, the second layer serving as a sensingmaterial; and a third layer on the second layer, the third layercomprising an insulating material. Further, the second layer and thethird layer may be coupled using a first electrode comprising a firstconductive thread and a first non-conductive thread. Additionally, thefirst conductive thread may be embedded in the second layer. Also, thefirst layer and the second layer may be further coupled using a secondelectrode comprising a second conductive thread and a secondnon-conductive thread, where the second conductive thread may beembedded in the second layer.

According to another embodiment, a method of fabricating a sensor forstatic and dynamic body measurements is provided. The method may includesteps of providing a first layer serving as a flexible support material;disposing a second layer on the first layer, the second layer serving asa sensing material; disposing a third layer on the second layer, thethird layer comprising an insulating material; coupling the second layerand the third layer using a first electrode comprising a firstconductive thread and a first non-conductive thread, the firstconductive thread embedded in the second layer; and coupling the firstlayer and the second layer using a second electrode comprising a secondconductive thread and a second non-conductive thread, the secondconductive thread embedded in the second layer.

In some embodiments, the sensor is a first sensor, and the methodfurther comprises fabricating a second sensor spaced laterally from thefirst sensor along a common horizontal axis or a common vertical axis bysteps of: disposing a fourth layer on the first layer, the fourth layerserving as a second sensing material; disposing the third layer on thefourth layer, the third layer comprising the insulating material;coupling the fourth layer and the third layer using a third electrodecomprising a third conductive thread and a third non-conductive thread,the third conductive thread embedded in the fourth layer; and couplingthe fourth layer and the first layer using a fourth electrode comprisinga fourth conductive thread, the fourth conductive thread embedded in thefourth layer.

In some embodiments, the first electrode comprising the first conductivethread and the first non-conductive thread, and the second electrodecomprising the second conductive thread and the second non-conductivethread, are couple by the first layer and the second layer, wherein thefirst conductive thread and the second conductive thread are embedded inthe second layer, and wherein the first non-conductive thread and thesecond non-conductive thread are embedded in the first layer.

In some embodiments, the first electrode comprising the first conductivethread and the first non-conductive thread, and the second electrodecomprising the second conductive thread and the second non-conductivethread are couple by the third layer and the second layer, wherein thefirst conductive thread and the second conductive thread are embedded inthe second layer, and wherein the first non-conductive thread and thesecond non-conductive thread are embedded in the third layer.

In some embodiments, the method further comprises configuring, (i) across-sectional shape of the first electrode or the second electrode, or(ii) a spacing between two or more of the first electrode and the secondelectrode, to alter a response time, an input dynamic range, an outputdynamic range, and/or a sensitivity of the sensor.

In some embodiments, the first and the second conductive thread and thefirst and the second non-conductive thread can be used in a spool,sewing needle, top thread, bobbin, and/or combinations thereof.

In some embodiments, the sensor is a first sensor, and the firstelectrode (electrode 1) of the first sensor is connected with a secondsensor with an electrode 2 by bonding the electrode 1 with the electrode2 with conductive epoxy, spray, paint, or a conductively doped adhesivematerial.

In some embodiments, the sensor is a first sensor, and the firstelectrode (electrode 1) of the first sensor is connected with a secondsensor with an electrode 2 by terminating the electrode 1 with aconductive terminal attached to a conductive wire, thread, material,and/or combinations thereof, that is used to overlap with the electrode2.

In some embodiments, the sensor is a first sensor, and the firstelectrode (electrode 1) of the first sensor is connected with a secondsensor with an electrode 2 by terminating both the electrode 1 and theelectrode 2 with a conductive terminal that is connected togetherphysically, magnetically, and/or combinations thereof.

In some embodiments, the sensor is a first sensor, and the firstelectrode (electrode 1) of the first sensor is connected with a secondsensor with an electrode 2 by overlapping the ends of the electrode 1 ofthe first sensor with the electrode 2 of the second sensor using a thirdconductive material to overlap the ends of the electrode 1 with theelectrode 2. In some embodiments, the overlap of electrode 1 andelectrode 2 is achieved using manual, mechanical, electrical,computerized, embroidery stitches, threading, and/or combinationsthereof. In some embodiments, the overlap of the electrode 1 and theelectrode 2 is achieved by using resins, sprays, paints, epoxies, and/orcombinations thereof to bond the electrode 1 with the electrode 2 with aconductively doped adhesive. In some embodiments, the overlap of theelectrode 1 and the electrode 2 is achieved by using a conductiveterminal, a magnetic terminal, and/or combinations thereof.

In some embodiments, the first electrode comprises at least oneconductive thread, wherein at least one conductive thread is one or moreply per conductive thread, and at least one non-conductive thread,wherein at least one non-conductive thread is one or more ply pernon-conductive thread, wherein the at least one conductive thread andthe at least one non-conductive thread are interlaced when embedded in agiven layer, wherein the at least one conductive thread or the at leastone non-conductive thread are separately exposed on a front or a back ofthe given layer, or exposed on a same side of the given layer, andwherein the at least one conductive thread or the at least onenon-conductive thread is patterned to a shape or an area of acorresponding conductive or non-conductive layer.

In some embodiments, the conductive thread comprises a dopant, whereinthe dopant is selected from the group consisting of a group I element, agroup II element, a transition metal, a group III element, a group IVelement, a group V element, a group VI element, a group VII element, andcombinations thereof.

In some embodiments, a tension between the conductive thread and thenon-conductive thread is configured to alter a tensile strength, astability, a texture, an elasticity, and/or a friability of the firstelectrode or the second electrode.

In some embodiments, altering an exposed length between thenon-conductive to conductive segments in coupled layer(s) is configuredto alter a conductivity and/or a sensitivity of the first electrode orthe second electrode.

In some embodiments, (i) a dopant, (ii) a ply count, and/or (iii) athread pattern density, is configured to alter a conductivity and/or asensitivity of the first electrode or the second electrode.

In some embodiments, the first layer, the second layer, the third layer,the first electrode, and/or the second electrode can be furtherfabricated or modified using electrospinning/spraying, spray painting,and combinations thereof.

Other embodiments, features, utilities, and advantages of the presentinvention will be apparent from the detailed description of theinvention when read in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying figures illustrate a number of exemplary embodimentsand are a part of the specification. Together with the followingdescription, these figures demonstrate and explain various principles ofthe instant disclosure.

FIG. 1A shows a diagram of a cross-sectional view of an example sensorin a sensing architecture, in accordance with example embodiments of thedisclosure.

FIG. 1B shows a diagram of another cross-sectional view of an examplesensor, in accordance with example embodiments of the disclosure.

FIG. 1C shows a diagram of a cross-sectional view of an exampleelectrode that can be used in connection with a sensor, in accordancewith example embodiments of the disclosure.

FIG. 1D shows a diagram of a cross-sectional view of an examplethreading scheme that can be used in connection with a sensor, inaccordance with example embodiments of the disclosure.

FIG. 2A shows a diagram of a cross-sectional view of an example sensorin another sensing architecture, in accordance with example embodimentsof the disclosure.

FIG. 2B shows a diagram of another cross-sectional view of an examplesensor in another sensing architecture, in accordance with exampleembodiments of the disclosure.

FIG. 3A shows a diagram of a cross-sectional view of an example sensorin another sensing architecture, in accordance with example embodimentsof the disclosure.

FIG. 3B shows a diagram of an overhead view of an example sensor, inaccordance with example embodiments of the disclosure.

FIG. 3C shows a diagram of a cross-sectional view of signals generatedby an example sensor, in accordance with example embodiments of thedisclosure.

FIG. 3D shows a diagram of another cross-sectional view of signalsgenerated by an example sensor, in accordance with example embodimentsof the disclosure.

FIG. 4 shows diagrams illustrating different sensing geometries that maybe used to detect various parameters (e.g., voltage, current,resistance, capacitance, inductance), in accordance with exampleembodiments of the disclosure.

FIG. 5 shows a diagram illustrating the placement of electrodes on asensing material (e.g., fabric), in accordance with example embodimentsof the disclosure.

FIG. 6 shows another diagram illustrating the placement of electrodes ona sensing material (e.g., fabric), in accordance with exampleembodiments of the disclosure.

FIG. 7 shows an example diagram of an application of the electronicdevices described herein, in accordance with example embodiments of thedisclosure.

FIG. 8 shows a diagram of electrode arrangements with respect to asensing material, in accordance with example embodiments of thedisclosure.

FIG. 9 shows diagrams depicting different configurations for theelectrode leads associated with a given portion of the sensor, inaccordance with example embodiments of the disclosure.

FIG. 10 shows diagrams that describe the coupling of a sensing materialand a portion of an article of clothing, in accordance with exampleembodiments of the disclosure.

FIG. 11A-11C show diagrams that describe various aspects of the couplingof a sensing material and a portion of an article of clothing, inaccordance with example embodiments of the disclosure.

FIG. 12 shows diagrams of example connectors that may be used toelectronically couple different regions of conductive materials (e.g.,conductive fabrics), in accordance with example embodiments of thedisclosure.

FIG. 13 shows a diagram including a plot of resistance versus conductivelayer thickness, in accordance with example embodiments of thedisclosure.

FIG. 14 shows a diagram of example plots of sensor characteristics withvarying fabric thickness, in accordance with example embodiments of thedisclosure.

FIG. 15 shows a diagram of example plots of sensor characteristics withvarying sensing material (e.g., conductive fabric) density (e.g., fromsparse to dense), in accordance with example embodiments of thedisclosure.

FIG. 16 shows a diagram of example plots of sensor characteristics withvarying sensing material (e.g., conductive fabric) elasticity (e.g.,from relatively stiff to elastic), in accordance with exampleembodiments of the disclosure.

FIG. 17 shows example diagrams of example sensing mechanisms of theelectronic devices described herein, in accordance with exampleembodiments of the disclosure.

FIG. 18 shows an example diagram of an article of clothing includingvarious components described herein, in accordance with exampleembodiments of the disclosure.

FIG. 19 shows a diagram representing an example flow of communicationand data between the disclosed electronic devices and one or moreperipheral devices, in accordance with example embodiments of thedisclosure.

FIG. 20 shows diagrams of example applications for the disclosedelectronic devices, in accordance with example embodiments of thedisclosure.

FIG. 21 shows an example flow diagram that may represent aspects of thefabrication of the electronic devices described herein, in accordancewith example embodiments of the disclosure.

FIG. 22 shows a diagram of an example computational environment for theelectronic devices described herein, in accordance with exampleembodiments of the disclosure.

Throughout the figures, identical reference characters and descriptionsindicate similar, but not necessarily identical, elements. While theexemplary embodiments described herein are susceptible to variousmodifications and alternative forms, specific embodiments have beenshown by way of example and will be described in detail herein. However,the exemplary embodiments described herein are not intended to belimited to the particular forms disclosed. Rather, the instantdisclosure covers all modifications, equivalents, and alternativesfalling within this disclosure.

DETAILED DESCRIPTION OF THE INVENTION

As will be explained in greater detail below, embodiments of the instantdisclosure are generally directed to providing static and dynamic bodymeasurements, and methods and systems for manufacturing apparatuses forthe same.

In various aspects, sensors (e.g., pressure sensitive sensors) may havea wide range of applications in a variety of fields including industry,sports, medicine, and others in part due to their ease of use,relatively simple construction, and their direct input-to-output sensingmechanism. In some aspects, construction of pressure sensitive sensorsmay include the fabrication of force sensitive resistors (FSRs), inwhich a material's resistance can change as a function of an appliedforce. Other methods may be used, including, but not limited to,capacitive and/or inductive touch techniques, strain resistance-basedtechniques, infrared and/or optical methods, combinations thereof,and/or the like.

In one embodiment, FSRs may be used as a sensing modality based at leastin part on because FSR construction may be relatively cheap, easy, andindustrially accessible in comparison with the other techniques listedabove. One constraint on FSRs that may limit potential applications(e.g., applications in sports and health-care) may be in designingcustom and tunable form-factors that can fit into complex geometries andshapes. Further, pressure sensitive sensors may need to includematerials capable of tolerating stress and strain resulting fromexcessive use (e.g., in applications geared towards the human body)without inducing material fatigue and/or breakdown. In another aspect,the pressure sensitive sensors may need to comfortably fit into a user'sclothing, or may need to seamlessly contact the skin without causingpain, discomfort, or unnecessary disturbances over time.

Disclosed herein are systems, methods, and apparatuses that are directedto flexible pressure sensors including pressure sensitive materials thatmay be used in many applications such as in wearable devices andarticles of clothing. While some of the disclosed embodiments aredirected towards specific areas of the body (e.g., the foot), it is tobe understood that the various disclosed embodiments may be applied formany other areas of the body including, but not limited to, shirts,pants, undergarments, hats, combinations thereof, and/or the like.

In various embodiments, embodiments of the disclosure are directed toelectronic devices including such pressure sensitive sensors thatinclude conductive and electrically sensitive materials. In anotherembodiment, the electronic devices may have an orthogonal sensingcapability which may be imparted by the configuration of the sensors aswill be further described herein. In particular, orthogonal sensing mayrefer to the electronic device being capable of performing independentmeasurements that do not influence one another, for example, pressuremeasurements, bend measurements, and stretch measurements. In anotherembodiment, the electronic device may be capable of combining multiplesensors to generate multiple signals corresponding, for example, thatmay correspond with a given area and/or portion of a user's body. In oneembodiment, various artificial intelligence (AI)-based algorithms and/ormachine learning algorithms may be implemented in connection with thedisclosed electronic devices, for example, for sensing and detectingmovement, position, performing predictive analytics, and/or the like. Inanother embodiment, various position reconstruction algorithms may beused in connection with the disclosure, including, but not limited to,EFT (Electric Field Tomography), EIT (Electric Impedance Tomography),RFDT (Radio Frequency Distance Tomography), to be described below. Suchalgorithms may be used, for example, to learn of a user's motionbehavior over time and space.

In various embodiments, embodiments of the disclosure may findapplications in many fields, including in healthcare relatedapplications. For example, embodiments of the disclosure may be used todetect and provide feedback on a user's posture and/or gait. Further,the posture and/or gait of the user may be tracked using the sensors incombination with at least one processor and non-transitorycomputer-readable medium, and the tracked data may be used to determineand log improvements. In various aspects, embodiments of the disclosuremay be used for injury and/or disease detection (e.g., by analysis ofgait or posture data, or the like), and feedback may be provided to theuser to accelerate healing and prevent further complications. Inparticular, various neuromuscular and/or skeletal diseases and disordersmay have particular gait signatures that may be collected using thesensors embedded in footwear of users, and the data may be interpretedby one or more experts (e.g., doctors and related medical professionals)in combination with AI-based algorithms.

In various embodiments, the electronic devices disclosed herein may beincorporated with other sensors, including, but not limited to, inertialmeasurement units (IMUs). Non-limiting examples of such IMU componentsinclude accelerometers, gyrometers, magnetometers, barometers, and/orthe like. Alternatively, or additionally, the electronic devices may beintegrated with a variety of different sensors including, but notlimited to, Hall effect sensors (e.g., to perform magneticmeasurements), strain gauge sensors, force sensing resistors,temperature sensors, light-emitting diodes (LEDs), photodiodes,combinations thereof, and/or the like. Such sensors may provideadditional data that may be combined with the data provided by thesensors described herein. The additional data may be fused with the datacollected by the sensors, for example, in near-real time using a Kalmanfilter (or other suitable filter and/or algorithm), and dynamic actionsmay be taken as a result of the combined inputs (e.g., a notificationmay be sent to a medical professional when an accelerometer indicates afall and a pressure sensitive sensor as described herein indicates ahigh force impact to a portion of the users body such as a hip or asensitive joint).

As noted, embodiments of the disclosure as relate to the electronicdevices and sensors may find many applications in a variety ofindustries. For example, the electronic device and sensors may findapplication in ergonomics. In particular, the electronic device and oneor more sensors may be used to monitor one or more of the followingconditions in users: (i) back bending resulting from user slouching,(ii) over-extension of back or rotation of the torso, curvature and bendof the neck, (iii) angle of hip from horizontal and knee from verticalwith bend measurements, (iv) left/right twist of torso relative to hip.

Another example application of the various embodiments of the disclosureincludes applications used in connection with kinetic take (e.g.,kinesio tape). For example, electronic device including fabric-basedsensors can be interlaced, bonded, or fabricated with kinesio tape.Moreover, the sensors may be used to determine the effectiveness of thekinesio tape. For example, the sensors may be used to measure whetherthe kinesio tape is limiting the amount of bending or stretching on acertain joint or muscle group of a user. In another embodiment, one ormore AI-based algorithms and/or machine learning algorithms may be usedin connection with the sensors and/or kinesio tape to recommend moreeffective areas to allocate the tape on the body of the user. Further,the algorithms may recommend if replacing the tape is necessary, orfitting a different size is necessary or recommended.

Other non-limiting example applications of the various embodiments ofthe disclosure include application used in connection with sports andcoaching, physical therapy, augmented and/or virtual reality (e.g., thegeneration of motion data which can be used to generate one-to-oneavatar movement). In the above applications (and similar applications),the electronic devices may be used to provide feedback to the userand/or user devices. For example, the electronic devices may be used todetect abnormal user motion and may emit a corresponding notification(e.g., phone alert, phone ring, watch alert, watch ring, buzzer, LEDsignal or light notifications, haptics, for example, through buzzers orringers embedded into the electronic device).

In various embodiments, the electronic devices may have a multi-layerconstruction. For example, in an embodiment, the electronic device mayinclude pressure sensitive materials and be composed of at least threecomponents: (1) an anode that may serve to generate a signal, (2) apressure sensitive material layer, and (3) a cathode that may serve as areference layer, and which may be electronically grounded. In anotherembodiment, the electronic device may include one or more additionaloptional layers. For example, the electronic device may include aseparator layer between the anode and cathode, for example, to preventsignal shorts. Finally, the electronic device may comprise a pressuresensitive material (e.g., a composite) that may include a fabric orsoft-material layer to serve as a comfortable contact with human skin.Additional layers may be contemplated and may have additional advantagesin terms of a device's input or output dynamic range, sensitivity, noisetolerance, combinations thereof, and/or the like. In variousembodiments, the layers may be merged with conductive or insulatingadhesive depending on the contacting interface.

In various embodiments, the electronic devices may have a single-layerconstruction. In another embodiment, the electronic device including thepressure sensitive material layer that may further comprise twoconducting layers that may be separated laterally, rather thanvertically. Accordingly, the reference layer for a multi-touch pressuresensitive material is combined to a single trace that contours aroundthe signal layer. These traces can be cut, milled, sewn, or printed in asingle layer and embedded onto the desired substrate. The pressuresensitive material can be placed on top of this layer and finally theentire composite can be covered in a shrouding fabric layer. In thisconstruction, there is no need for a separator, as the positive andnegative conductive layers are separated spatially on the same plane.

FIG. 1A shows a diagram of a cross-sectional view of an example sensorin a sensing architecture, in accordance with example embodiments of thedisclosure. In particular, FIG. 1A shows a diagram of a sensor 100. Invarious embodiments, the sensor 100 may be part of a device (not shown)that may be embedded or otherwise coupled to an article of clothing. Inone embodiment, the sensor 100 may include a first layer 102 serving asa flexible support material that may be an insulating material such as afabric. In another embodiment, the sensor 100 may include a second layer104 on the first layer 102, the second layer serving as a sensingmaterial such as a sensing fabric, which may include a conductivematerial. Further, in one embodiment, the sensor 100 may include a thirdlayer 106 on the second layer 104, the third layer 106 including aninsulating material such as an insulating fabric. Moreover, the secondlayer 104 and the third layer 106 may be coupled (e.g., electronicallyand/or mechanically coupled) using a first electrode E1 comprising afirst conductive thread and a first non-conductive thread (to bedescribed in connection with FIG. 1D, below), the first conductivethread embedded in the second layer 104. Additionally, the second layer104 and the third layer 106 may be further coupled using a secondelectrode E2 comprising a second conductive thread and a secondnon-conductive thread, the second conductive thread embedded in thesecond layer. In various embodiments, a cross-sectional shape of theelectrodes and/or the spacing between the electrodes may be configuredto increase a response time, an input dynamic range, output dynamicrange, and/or a sensitivity of the sensor. In another embodiment, athickness of the second layer 104 including the sensing material may bebetween about 100 microns to several centimeters, and the thickness ofthe sensing material may be configured to increase a response time, aninput dynamic range, output dynamic range, and/or a sensitivity of thesensor 100. In another embodiment, the sensing material may befabricated using an electrospinning and/or spraying technique, in whichcase the thickness of the sensing material may be between approximately100 nm to approximately 1 mm.

In various embodiments, although one sensor (e.g., sensor 100) wasdescribed in connection with FIG. 1A, various embodiments may becontemplated where multiple sensors (e.g., 1, 2, 10, 100, 1000 . . . Nsensors, where N is an integer) may be positioned within a fixeddistance (e.g., tolerance) of each other on a horizontal planecorresponding to the in-plane axis of a portion of an article ofclothing such as a garment or an insole of a shoe. In particular, asmany sensors as desired may be added in such a horizontal place as longas the sensors are able to fit (e.g., the inter-sensor spacing may beconfigured to allow for the maximum packing of sensors such that theelectrodes and various conductive traces of each sensor do notphysically and/or electronically overlap). In another embodiment, thesensor spacing may be determined based on an electromagneticinterference (EMI) test of the sensors. In particular, the spacing maybe determined such that the sensors do not generate electromagneticcross-coupling beyond a given threshold, as such EMI may lead to coupledsensor output. Moreover, in some embodiments, the multiple sensors on agiven horizontal plane may include a common electrode that may be sharedbetween at least a subset of the sensors.

FIG. 1B shows a diagram of another cross-sectional view of an examplesensor, in accordance with example embodiments of the disclosure. Inparticular, FIG. 1B shows another diagram of a sensor 109. Inparticular, FIG. 1B shows a diagram of a sensor 109 having a differentconfiguration (e.g., vertical configuration of electrodes E1 and E2)with respect to FIG. 1A. In various embodiments, the sensor 109 may alsobe part of a device (not shown) that may be embedded or otherwisecoupled to an article of clothing. In particular, the sensor 109 maywork in conjunction with sensor 100 as part of the same device or aspart of a different device that may be embedded or otherwise coupled toan article of clothing.

In one embodiment, the sensor 109 may again include a first layer 103serving as a flexible support material that may be an insulatingmaterial such as a fabric. In another embodiment, the sensor 109 mayalso include a second layer 105 on the first layer 103, the second layerserving as a sensing material such as a sensing fabric, which mayinclude a conductive material. Further, in one embodiment, the sensor109 may include a third layer 107 on the second layer 105, the thirdlayer 107 including an insulating material such as an insulating fabric.Moreover, the first layer 103 and the second layer 105 may be coupled(e.g., electronically and/or mechanically coupled) using a firstelectrode E1 comprising a first conductive thread and a firstnon-conductive thread (to be described in connection with FIG. 1D,below), the first conductive thread embedded in the second layer 105.Additionally, the second layer 105 and the third layer 107 may befurther coupled using a second electrode E2 comprising a secondconductive thread and a second non-conductive thread, the secondconductive thread embedded in the second layer 105. In variousembodiments, a cross-sectional shape of the electrodes and/or thespacing between the electrodes may be configured to increase a responsetime, an input dynamic range, output dynamic range, and/or a sensitivityof the sensor. In another embodiment, a thickness of the second layer105 including the sensing material may be between about 100 microns toseveral centimeters, and the thickness of the sensing material may beconfigured to increase a response time, an input dynamic range, outputdynamic range, and/or a sensitivity of the sensor. In anotherembodiment, the sensing material may be fabricated using anelectrospinning and/or spraying technique, in which case the thicknessof the sensing material may be between approximately 100 nm toapproximately 1 mm.

In various embodiments, similar to the discussion for FIG. 1A, althoughone sensor (e.g., sensor 109) is described in connection with FIG. 1B,various embodiments may be contemplated where multiple sensors (e.g., 1,2, 10, 100, 1000 . . . N sensors, where N is an integer) may bepositioned within a fixed distance (e.g., tolerance) of each other on ahorizontal plane corresponding to the in-plane axis of a portion of anarticle of clothing such as a garment or an insole of a shoe.

In various embodiments, the sensors 100 and 109 depicted in FIGS. 1A and1B may be stacked vertically or horizontally, or both. Further, thesensors may be fabricated individually and stacked vertically orpositioned horizontally or both, after fabrication. In variousembodiments, vertically stacked sensors may be secured to one anotherand/or an article of clothing such as a portion of a garment usingnon-conductive threads. In another embodiment, multiple sensors can befabricated on a given horizontal plane of at least a portion of anarticle of clothing such as a garment; further, the sensors and/or theportion of the article of clothing may be spatially configured (e.g.,folded together) in order to position the sensors in stacked verticalconfiguration, as will be further shown and described herein inconnection with FIG. 11A.

In various embodiments, stacking sensors may yield several advantages,including, but not limited to, one or more of the following. In anaspect, such a configuration of sensors may increase the signal-to-noiseratio (SNR) of an electronic device having the stacked sensors. Inparticular, the signal from the stacked sensors can be averaged toreduce noise. In another aspect, devices including stacked sensors maynot have any appreciable reduction in the response time, input dynamicrange, output dynamic range, and/or device sensitivity (see FIGS. 11,and 13-16 and related discussion for more description related to theseparameters); this may be based at least in part on the fact that thesensors may operate independently from one another (e.g., the sensorconfiguration may impart an orthogonal sensing capability). In anotheraspect, the number of wires and connections to a given electronic device(e.g., at the electronic device's electrodes) having multiple sensorsmay be increased, while the device may be configured to output one(averaged) value for a given measurement (e.g., a force, a pressure, andthe like). In another aspect, the stacked sensors may be used togenerate depth sensing data. For example, a first sensor in the stack ofsensors that is closest to a portion of the user's body undergoingmovement may generate a measurement with relatively little force input,while more force is required to activate the deepest sensor in the stackof sensors. Accordingly, a gradient of signals representing forcemeasurements may be generated down the vertical stack of sensors whichmay be used to determine the amount of force that penetrated into agiven portion of an article of clothing and at what distance that forcepenetrated into the article of clothing. In another embodiment, a deviceconfigured to have the multiple sensors may become thicker and/or bulky;accordingly, the form-factor and comfort of the user wearing an articleof clothing including the device may need to be weighed against theadvantages described above.

FIG. 1C shows a diagram of a cross-sectional view of an exampleelectrode that can be used in connection with a sensor, in accordancewith example embodiments of the disclosure. In particular, the electrode120 may include a first portion 108, the first portion including atleast some of the sensing material (e.g., sensing fabric). Moreover, theelectrode 120 may include a second portion 110 including at least someof the insulating material (e.g., insulating fabric). Moreover, theelectrodes may be threaded in order to couple to the first portion 108and the second portion 110 of the electrode 120 as shown and describedin connection with FIG. 1D, below. Further, in an embodiment, conductivethread may be embedded in the first portion 108 including the sensingmaterial, while non-conductive thread may be embedded in the secondportion 110 including the insulating material.

In some embodiments, the various layers (e.g., the layers serving as aflexible support material, sensing materials, and/or insulatingmaterials) may have a material composition that includes a fabric and/ora polymer. In various embodiments, the fabrics may include, but not belimited to, one or more of the following materials: organza, denim,velvet, brocade, corduroy, flannel, crepe, damask, felt, tweed, gauze,lawn cloth, charmeuse, khaki, tartan, combinations thereof, and/or thelike. In another embodiment, the sensing material and/or any insulatingor support materials may include flexible materials including, but notbe limited to, one or more of mylar, epoxy, polyethylene terephthalate(PET), polyethylene (PE), polypropylene (PP), polystyrene (PS),polyvinyl chloride (PVC), polyamide (PA), combinations thereof, and/orthe like.

In various embodiments, the various layers shown in FIGS. 1A and 1B(e.g., second layers 104 and 105) including the sensing materials mayinclude a dopant. Further, the dopant may include any suitableconcentration of a material including compounds having materials from atleast groups I, II, III, IV, V, VI, VII, or transition metals of theperiodic table of elements. In various embodiments, the dopants mayinclude group I elements including, but not limited to, lithium, sodium,and/or the like. The dopants may further include group II elementsincluding, but not limited to, magnesium, calcium, and/or the like. Thedopants may further include group III elements including, but notlimited to, boron, aluminum, gallium, and/or the like. The dopants mayfurther include group IV elements including, but not limited to,silicon, germanium, and/or the like. The dopants may further includegroup V elements including, but not limited to, phosphorus, arsenic,and/or the like. The dopants may further include group VI elementsincluding, but not limited to, sulfur, selenium, and/or the like. Thedopants may further include group VII elements including, but notlimited to, chlorine, bromine, and/or the like. Further, the dopants mayfurther include transition metals including, but not limited to, nickel,zinc, and/or the like. The dopants may further include, but not belimited to, rare-earth metals, such as the lanthanide series. Morecomplex dopants may include combinations of at least the dopants listedabove, for example, cadmium sulfide. Examples of such complex dopantsmay include, but not be limited to, gallium arsenide, gallium phosphide,gallium nitride, cadmium telluride, cadmium sulfide, and combinationsthereof.

In some embodiments, the electrodes described herein and depicted forexample, in FIG. 1C (e.g., electrode 120) may be structured in a numberof different ways. For example, cross-section or an overhead section ofan electrode may form a non-angular shape, or may be a more complexshape (e.g., patterned or freeform). In some embodiments, the electrodemay be shaped to allow compression and expansion of the electroactivedevice during operation (e.g., under the application of pressure byvarious part of the body).

In some embodiments, an electrode (e.g., electrode 120) may includemetals such as aluminum, gold, silver, tin, copper, indium, gallium,zinc, and the like. Other conductive materials may be used, includingcarbon nanotubes, graphene, transparent conductive oxides (TCOs, e.g.,indium tin oxide (ITO), zinc oxide (ZnO), etc.), and the like.

In some configurations, it may be necessary for the electrodes (e.g.,electrodes E1 and E2 of FIGS. 1A and 1B) to stretch elastically. In suchembodiments, the electrodes may include TCOs, graphene, carbonnanotubes, and the like. In other embodiments, for example, embodiments,relatively rigid electrodes (e.g. electrodes including a metal such asaluminum) may be used. In some embodiments, the electrodes may have athickness of approximately 100 nm to approximately 10 mm, with anexample thickness of approximately 10 microns to approximately 1 mm. Insome embodiments, the electrodes may be fabricated using any suitableprocess. For example, the electrodes may be fabricated using physicalvapor deposition (PVD), chemical vapor deposition (CVD), sputtering,spray-coating, spin-coating, atomic layer deposition (ALD), and thelike. In another aspect, the electrodes may be manufactured using athermal evaporator, a sputtering system, a spray coater, a spin-coater,an ALD unit, combinations thereof, and/or the like.

FIG. 1D shows a diagram of a cross-sectional view of an examplethreading scheme that can be used in connection with a sensor, inaccordance with example embodiments of the disclosure. In particular,diagram 130 shows a first thread 112 and a second thread 114 that may beused to stitch together a portion of a sensing material (e.g., layer 104or 105 of FIGS. 1A and 1B, respectively) to a portion of an insulatingmaterial (e.g., layer 106 or layers 103 and 107 of FIGS. 1A and 1B,respectively). Further, the first thread 112 may include a conductivematerial, while the second thread 114 may include a non-conductivematerial.

In some embodiments, the conductive thread may include any suitablemetal, semiconductor material, or conductive polymer. Non-limitingexamples may include, but not be limited to, organic conductivematerials such as poly(3,4-ethylenedioxythiophene) polystyrene sulfonate(PEDOT-PSS), PEDOT-PSS and polyvinyl alcohol (PVA), polypyrrole (PPy),polyaniline (PANI), combinations thereof, and/or the like. In someembodiments, the materials used to make a conductive thread can also beused as a dopant. For example, a nickel conductive thread can be dopedwith trace amounts of copper and vice-versa. As noted, the dopants mayadditional include group I elements including, but not limited to,lithium, sodium, and/or the like. The dopants may further include groupII elements including, but not limited to, magnesium, calcium, and/orthe like. The dopants may further include group III elements including,but not limited to, boron, aluminum, gallium, and/or the like. Thedopants may further include group IV elements including, but not limitedto, silicon, germanium, and/or the like. The dopants may further includegroup V elements including, but not limited to, phosphorus, arsenic,and/or the like. The dopants may further include group VI elementsincluding, but not limited to, sulfur, selenium, and/or the like. Thedopants may further include group VII elements including, but notlimited to, chlorine, bromine, and/or the like. Further, the dopants mayfurther include transition metals including, but not limited to, nickel,zinc, and/or the like. The dopants may further include, but not belimited to, rare-earth metals, such as the lanthanide series. Morecomplex dopants may include combinations of at least the dopants listedabove, for example, gallium arsenide, gallium phosphide, galliumnitride, cadmium telluride, cadmium sulfide, and combinations thereof.

In various embodiments, the conductive thread 112 and/or thenon-conductive thread 114 may be sown using a sewing or embroiderymachine. In particular, the conductive thread either may be configuredon the bobbin or sewing needle and can be sewn on the bottom or top of afabric by adjusting the tension on the sewing needle. In anotherembodiment, a higher tension on the needle may pull the bobbin andsewing thread to the top of the sewn material, that is, for example, tothe sensing material. In another embodiment, a looser tension may serveto pull the bobbin and sewing thread to the bottom of the sewn material,for example, to the insulating material. Accordingly, an average tensionon the sewing need may serve to keep a bobbin thread on the bottom,while the sewing thread on the top as shown in FIG. 1D.

In some embodiments, as will be further described in connection with thevarious diagrams of FIG. 13-16, a density per unit area of a stitchingof the conductive threads associated with the electrodes may beconfigured to increase a response time, an input dynamic range, anoutput dynamic range, and/or a sensitivity of the sensors. In anotherembodiment, the radius of the conductive threads may be configured toincrease one or more of a response time, an input dynamic range, outputdynamic range, or a sensitivity of the sensor.

FIG. 2A shows a diagram of a cross-sectional view of an example sensorin another sensing architecture, in accordance with example embodimentsof the disclosure. In particular, FIG. 2A shows a diagram of across-sectional view of an example sensor having a vertical architectureof sensing materials, in accordance with example embodiments of thedisclosure.

In various embodiments, the sensor 200 may be part of a device (notshown) that may be embedded or otherwise coupled to an article ofclothing. In one embodiment, the sensor 200 may include a first layer202 serving as a flexible support material that may be an insulatingmaterial such as a fabric. In another embodiment, the sensor 200 mayinclude a second layer 204 on the first layer 202, the second layerserving as a sensing material such as a sensing fabric, which mayinclude a conductive material. Further, in one embodiment, the sensor200 may include a third layer 206 on the second layer 204, the thirdlayer 206 including an insulating material such as an insulating fabric.Moreover, the first layer 202 and the second layer 204 may be coupled(e.g., electronically and/or mechanically coupled) using a firstelectrode E1 comprising a first conductive thread and a firstnon-conductive thread (as described in connection with FIG. 1D), thefirst conductive thread embedded in the second layer 204.

In another embodiment, the sensor 200 may include a fourth layer 208 onthe third layer 206, the second fourth serving as a sensing materialsuch as a sensing fabric, which may include a conductive material.Further, in one embodiment, the sensor 200 may include a fifth layer 210on the fourth layer 208, the fifth layer 210 including an insulatingmaterial such as an insulating fabric. Moreover, the fourth layer 208and the fifth layer 210 may be coupled (e.g., electronically and/ormechanically coupled) using a second electrode E2 comprising a firstconductive thread and a first non-conductive thread (as described inconnection with FIG. 1D), the first conductive thread embedded in thefourth layer 208. Additionally, the sensor 200 may include a commonconnection 212 (also referred to as a common wire herein) that may serveto electrically couple the second layer 204 and the fourth layer 208together, that is, the two sensing materials together.

In various embodiments, a cross-sectional shape of the electrodes and/orthe spacing between the electrodes may be configured to increase aresponse time, an input dynamic range, output dynamic range, and/or asensitivity of the sensor. In another embodiment, a thickness of thesecond layer 104 including the sensing material may be between about 100microns to several centimeters, and the thickness of the sensingmaterial may be configured to increase a response time, an input dynamicrange, output dynamic range, and/or a sensitivity of the sensor 200. Inanother embodiment, the sensing material may be fabricated using anelectrospinning and/or spraying technique, in which case the thicknessof the sensing material may be between approximately 100 nm toapproximately 1 mm.

In various embodiments, although one sensor (e.g., sensor 200) wasdescribed in connection with FIG. 2A, various embodiments may becontemplated where multiple sensors (e.g., 1, 2, 10, 100, 1000 . . . Nsensors, where N is an integer) may be positioned within a fixeddistance (e.g., tolerance) of each other on a horizontal planecorresponding to the in-plane axis of a portion of an article ofclothing such as a garment or an insole of a shoe. In particular, asmany sensors as desired may be added in such a horizontal place as longas the sensors are able to fit (e.g., the inter-sensor spacing may beconfigured to allow for the maximum packing of sensors such that theelectrodes and various conductive traces of each sensor do notphysically and/or electronically overlap). In another embodiment, thesensor spacing may be determined based on an electromagneticinterference (EMI) test of the sensors. In particular, the spacing maybe determined such that the sensors do not generate electromagneticcross-coupling beyond a given threshold, as such EMI may lead to coupledsensor output. Moreover, in some embodiments, the multiple sensors on agiven horizontal plane may include a common electrode that may be sharedbetween at least a subset of the sensors.

FIG. 2B shows a diagram of another cross-sectional view of an examplesensor in another sensing architecture, in accordance with exampleembodiments of the disclosure. In particular, FIG. 2B shows a diagram ofa cross-sectional view of an example sensor having a horizontalarchitecture of sensing materials, in accordance with exampleembodiments of the disclosure.

In various embodiments, the sensor 201 may be part of a device (notshown) that may be embedded or otherwise coupled to an article ofclothing. In one embodiment, the sensor 201 may include a first layer214 serving as a flexible support material that may be an insulatingmaterial such as a fabric. In another embodiment, the sensor 201 mayinclude several second layers 216 on the first layer 214, the secondlayers serving as a sensing material such as a sensing fabric, which mayinclude a conductive material. Moreover, the sensor 201 may includeadditional second layers 217 on the first layer 214, the additionalsecond layers serving as an insulating material between the sensingsecond layers 216. Further, in one embodiment, the sensor 201 mayinclude a third layer 218 on the second layers 216 and layers 217, thethird layer 218 including an insulating material such as an insulatingfabric. Moreover, the first layer 214 and the second layers 216 may becoupled (e.g., electronically and/or mechanically coupled) using firstelectrodes E1 comprising a first conductive thread and a firstnon-conductive thread (as described in connection with FIG. 1D), thefirst conductive thread embedded in the second layers 216. Additionally,the second layers 216 and the third layer 218 may be coupled (e.g.,electronically and/or mechanically coupled) using common electrodes E2comprising a first conductive thread and a first non-conductive thread(as described in connection with FIG. 1D), the first conductive threadembedded in both second layers 216 and third layer 218. Moreover, thecommon electrodes E2 may be connected electronically using a commonconnection 220 (e.g., wired connection).

FIG. 3A shows a diagram of a cross-sectional view of an exampleelectronic device in another sensing architecture, in accordance withexample embodiments of the disclosure. At least a portion of theelectronic device may be disposed onto and within a garment such asgarment 307. In particular, the electronic device 300 may include afirst sensor S1 having a first sensing material and a first electrode E1along a top edge of the first sensing material, the first sensingmaterial wired to a first signal output, and a second electrode along abottom edge of the first sensing material, the second electrode coupledto a first insulating material. Further, the electronic device mayinclude a second sensor S2 spaced vertically from the first sensoracross the first insulating material. The second sensor may include: asecond sensing material and a third electrode electrically connected tothe second electrode, the second sensing material wired to a commonelectrical connection E0, the third electrode passing from a top edge ofthe second sensing material to a bottom edge of the second sensingmaterial, the third electrode coupled to a second insulating material,and a fourth electrode E2 along a top edge of the second sensingmaterial, the fourth electrode wired to a second signal output. In someembodiments, the second sensor may need to be on a neutral axis of thedevice, that is, an axis that does not compress or tense when beingbent, but only stretches.

In various aspects, the neutral axis may shift depending on thematerials used, the thickness of the top and bottom material layers,and/or the density/weight on each side of the layers. Further, theneutral axis may not necessarily strictly mean the middle; the neutralaxis may be skewed more on the top or bottom depending on the devicefabrication and configuration during operation.

In another embodiment, the electronic device may include a third sensorS3 spaced vertically from the second sensor across the second insulatingmaterial. In one embodiment, the third sensor may include: a thirdsensing material, a fifth electrode along a top edge of the thirdsensing material wired to a common electrical connection E0, and a sixthelectrode E3 along the bottom edge of the third sensing material. thesixth electrode wired to a third signal output.

In various embodiments, a density per unit area of a stitching of atleast one of the first conductive thread, the second conductive thread,the third conductive thread, and the fourth conductive thread isconfigured to increase a response time, an input dynamic range, and/or asensitivity of the sensor.

In another embodiment, a radius of at least one of the first conductivethread, the second conductive thread, the third conductive thread, andthe fourth conductive thread is configured to increase one or more of aresponse time, an input dynamic range, or a sensitivity of the sensor.In one embodiment, the first insulating material is disposed on a topside of the article, and wherein the second insulating material isdisposed on a bottom side of the article. In various embodiments, amaterial composition of at least of the first sensing material, thesecond sensing material, the third sensing material, the firstinsulating material, and the second insulating material is selected fromthe group consisting of a fabric and a polymer material. Moreover, atleast one of the first sensing material, the second sensing material,and the third sensing material comprises a dopant, as variouslydescribed herein. In another embodiment, a thickness of at least one ofthe first sensing material, the second sensing material, and the thirdsensing material is between about 100 microns to several centimeters. Inanother embodiment, the thickness of the first sensing material, thesecond sensing material, or the third sensing material is configured toincrease a response time, an input dynamic range, output dynamic range,and/or a sensitivity of the first sensor, the second sensor, or thethird sensor. In another embodiment, the first sensor, the secondsensor, or the third sensor, may be fabricated using an electrospinningand/or spraying technique, in which case the thickness of the sensingmaterial may be between approximately 100 nm to approximately 1 mm.

In another embodiment, (i) a cross-sectional shape of the electrodes or(ii) a spacing between two or more of the electrodes may be configuredto increase a response time, an input dynamic range, output dynamicrange, and/or a sensitivity of the first sensor, the second sensor, orthe third sensor.

In another embodiment, a normal force acting on a portion of the firstsensing material generates a compression of the first sensor and atension on the third sensor. Further, the sensors may be configured togenerate a bend signal, a pressure signal, and a stretch signal based onthe compression and the tension.

FIG. 3B shows a diagram of an overhead view of an example sensor, inaccordance with example embodiments of the disclosure. In particular,the overhead view 301 includes a view of the electrical connection forthe first electrode E1, the electrical connection for the secondelectrode E2, the electrical connection for the third electrode E3, andthe electrical connection for the forth (common wire) electrode E0.Moreover, a view of the insulating fabric is also shown from theoverhead view.

FIG. 3C shows a diagram 302 of a cross-sectional view of signalsgenerated by an example sensor, in accordance with example embodimentsof the disclosure. In various aspects, the resistivity of the sensingmaterial (e.g., the fabric) may be configured to correspond with theexpected pressure load to measure with a sensor. In another embodiment,perturbations, such as pressure, may results in a change of a materialparameter (e.g., resistance) of one or more portions of the pressuresensors, and this change of material parameter can be measured todetermine an output of the electronic device.

In particular, the sensors in device 302 may be configured to detect oneor more of a pressure 330, a compression 332, a stretching 334, tension336, and combinations thereof. In another embodiment, the sensors indevice 302 may have sensing orthogonality properties. For example, inorder to measure pressure 330 while avoiding measuring bending during apressure measurement of a given area, two pressure sensors may be placedabove and below the given area. In another embodiment, the compression332 and tension 336 forces that may contribute to bending in the givenarea may be measured by the two pressure sensors, respectively, andsubtracted from one another (e.g., by a computational module includingmemory and at least one processor), as shown in equation (4), below.Accordingly, because the two signal changes due to pressure 330 may havea similar magnitude but may have a sign difference (e.g., correspondingto the fact that the given area may exhibit a lower resistivity for acompressive force, and higher resistivity for a tension force), thepressure on the given area may be computed as the average of the twosensor values, as shown in equation (3), below. In another example, inorder to avoid making unwanted stretching measurements, at leastportions of the electronic device and/or portions of the garment mayinclude conductive fabrics that are laced with non-stretch fibers.Alternatively, or additionally, the conductive fabrics may be sewn ontoat least a portion of a non-stretch garment.

In various embodiments, the sensor may include one or more additionalsensors (S1 and S3) configured to detect bending (which may be referredto as bend sensors herein). In another embodiment, the construction ofsuch bend sensors may include placing conductive material (e.g., fabric)between two identical materials (e.g., fabric or another flexiblesubstrate). Further, the electronic device may feature a design suchthat the conductive fabrics are placed at a neutral axis of theelectronic device (e.g., as further shown and described in connectionwith element 348 of FIG. 3D, below).

As noted, in another embodiment, the sensors (S1, S2, and S3) may have asensing orthogonality property. For example, in order to avoid making anunwanted pressure 330 measurement on a given area, a first cushionmaterial may be positioned atop the sensing material of one of bendsensors S1, for example, in order to bear and dissipate the loadedpressure before contacting and impacting the sensing material. Inanother embodiment, a bend sensor S2 positioned on the neutral axis ofthe electronic device may increase resistance, while applied pressurereduces resistance. Therefore, bend sensing and pressure sensing can bedistinguished based at least in part on a sign change associated withthe resistance measurement of the given area.

Further, two pressure sensors may be positioned equidistant above andbelow the neutral axis of an electronic device. Further, the measuredvalues of the pressure sensors can be subtracted to isolate the bendingcomponent (e.g., due to compression and tension) and to remove theequivalent pressure component. Accordingly, the following equations maybe shown to hold:Sensor_((compression)) =P+B  (1)Sensor_((tension)) =P−B  (2)P=(Sensor_((compression))+Sensor_((tension)))/2  (3)B=(Sensor_((compression))−Sensor_((tension)))/2  (4)S=Sensor_((stretch)) −P  (5)

where P, B, and S are the pressure, bend, and stretch values,respectively.

In various embodiments, the electronic devices may include one or moresensors configured to detect stretching (which may be referred to asstretch sensors herein). In another embodiment, the construction of suchstretch sensors may include a single layer including a conductivematerial (e.g., conductive fabric) that may have a relatively minimalthickness (e.g., about 1 mm thick or less). Alternatively, theconstruction of such stretch sensors may include a thick conductivefiber with relatively high stretch and compression capabilities. Invarious embodiments, the electronic device may include sensors that havean orthogonality property. For example, the electronic device mayinclude a single sheet, or a minimally thin fabric that may not deformor bend if force is applied perpendicular to its surface area.Accordingly, stretching may only cause extension of fibers, therebychanging resistance of the electronic device. In another embodiment, forelectronic devices including thick conductive fibers with relativelyhigh compression and stretch capabilities, the capacitance, rather thanthe resistance, may be measured. For example, conductive pads may beadded to the electronic device, the conductive pads having definedsurface areas, and may be positioned at the above and below the fabric.Further, the capacitance may be measured using the formula: C=E₀A/d,where capacitance C is in units of Farads. Accordingly, stretchingthicker conductive fabrics may increase capacitance, C, as d decreases,as can be demonstrated by the above formula.

In various embodiments, the electronic device may include one or moresensors having a particular design based at least in part on the sensingmechanism. In one embodiment, the sensors may include components such asa conductive material (e.g., a conductive fabric), conductive traceshaving positive and negative terminals that can serve to measure variouselectronic parameters (e.g., voltage, current, resistance, capacitance,and/or inductances), and an insulating material for example, as an outerlayer.

In various aspects, the density of fibers, and conductivity of fibers,and ratio or mixture of conductive to non-conductive fibers in amaterial (e.g., a fabric) used in a sensor of an electronic device maybe proportional to the conductivity of the material (or inverselyproportional to the resistance of the material). In particular,resistance is defined as R=μl/A in units of Ohms (Ω), where l is thelength, A is the cross-sectional area, and ρ is the resistivity of thematerial (intrinsic to the material such as fabric).

FIG. 3D shows a diagram of another cross-sectional view of signalsgenerated by an example sensor, in accordance with example embodimentsof the disclosure. In various embodiments, diagram 305 shows conductivefabric 344 that may be implemented in an electronic device (not shown).The electronic device may be used to independently discern the effectsof pressure 358 as well as tension 354 and compression 352. In oneembodiment, a load 350 may cause lateral and/or longitudinaldeformation, which may generate pressure in the electronic device. Thismay be sensed by the top and bottom materials of the electronic device(e.g., non-conductive fabric 342, the conductive fabric 344) above andbelow the embedded conductive fabric 346. Further, bending may be sensedby the embedded conductive fabric 346 along a neutral axis 348 region ofthe electronic device. In another embodiment, stretching can be measuredby the electronic device by measuring the capacitance change between thetop and bottom materials fabrics (e.g., non-conductive fabric 342, theconductive fabric 344), or by sensing a resistance change along themiddle conductive fabric 346.

FIG. 4 shows diagrams 400 illustrating different sensing geometries thatmay be used to detect various parameters (e.g., voltage, current,resistance, capacitance, inductance), in accordance with exampleembodiments of the disclosure. As noted, the sensors may be fabricatedusing conductive materials such as conductive fabric. Further, thedimensions and the layout of conductive traces on conductive materialmay affect the characteristics of an electronic device's output. In oneembodiment, as noted, the disclosed electronic devices may includepressure sensors that may include a material such as fabric that is madeusing a conductive material.

In one embodiment, a distortion in a group of fibers of a sensor mayalter the compaction or tension of neighboring fibers, altering fiberdensity thereby changing resistance. In another embodiment, applyingpressure or weight onto a material having fibers (e.g., fabric) mayreduce the distance between adjacent conductive fibers of the sensor,reducing resistance of the sensor. In one embodiment, bending a sensoralong a compression zone of the sensor may reduce the distance betweenadjacent conductive fibers of the sensor, and thereby reduce theresistance of the sensor. In one embodiment, bending the sensor along atension zone of the sensor may increase the distance between adjacentconductive fibers of the sensor, and thereby increase the resistance ofthe sensor. In another embodiment, bending the sensor along a neutralaxis of the sensor may increase the resistance as the length of thefibers of the sensor increase.

In various embodiments, stretching of the sensor of an electronic devicemay lead to various changes in the parameters of the sensor, asdescribed below. In particular, if the stretching occurs along a fiberaxis (e.g. parallel to the seams) of the sensor, the fibers of thesensor may be elongated, and adjacent fibers of the sensor may becompressed together. Accordingly, the differences in stretching of thesensor and compression of the sensor may serve as opposing effects inthe sensor. Further, resistance of the sensor can either increase ordecrease depending on the conductivity of the fibers of the sensor, thethickness of the fibers of the sensor, the stretch-ability of fibers,and density of fibers of the sensor, combinations thereof, and/or thelike. In another embodiment, if the stretching occurs perpendicular tothe fiber axis (e.g. perpendicular to the seams) of the sensor, thefibers of the sensor may be separated from each other, therebyincreasing the resistance of the sensor.

In various embodiments, several techniques may be used to tune thesensitivity of the disclosed sensors used in the electronic devices, asdescribed below. In particular, changing the conductivity of thematerial comprising the sensor (e.g., fabric) may change the sensitivityof the sensors. In another embodiment, changing the density of weavedfibers in the sensor material (e.g., the fibers of a conductive fabric)may change the sensitivity of the sensors. Further, changing thethickness of the conductive coating on the sensor material (e.g., theconductive coating of a fabric) may change the sensitivity of thesensors. In another embodiment, changing the ratio of weaved conductivefibers of a conductive material to the non-conductive fibers of anon-conductive material may change the sensitivity of the sensors. Inone embodiment, changing the type of conductive material deposited ontoa sensor material (e.g., a fabric) may change the sensitivity of thesensors. In another embodiment, the method of fabricating the sensorsand constituent materials (e.g., via various deposition techniques) andvarious process parameters may serve to change the sensitivity of thesensors. In another embodiment, the type and number of layers ofconductive materials (e.g., fabrics) that may be weaved together maychange the sensitivity of the resulting sensors.

In various embodiments, various properties of conductive traces of theelectronic devices and associated sensors may be modified to change thesensitivity of the sensors. In particular, the spacing between negativeand positive leads of the sensors of the electronic device may bemodified to change the sensitivity of the sensors. In anotherembodiment, the contact area of the negative lead and positive lead ofthe sensors of the electronic device may be modified to change thesensitivity of the sensors. In one embodiment, the number ofinterdigitated negative and positive leads of the sensors of theelectronic device may be modified to change the sensitivity of thesensors as shown in FIG. 4.

In various embodiments, various trends related to parameters associatedwith the sensors may be used to optimize sensor performance. Forexample, increasing the density of conductive fibers of the material ofa sensor may reduce the resistance of the sensor. In another embodiment,increasing the thickness of the conductive coating on a sensor material(e.g., fabric) may reduce the resistance of the sensor material. In oneembodiment, increasing the ratio of conductive to non-conductivematerials (e.g., conductive fabrics) in the sensor material may reducethe resistance of the sensor material. In various embodiments, layeringmore conductive material such as conductive fabrics may reduce theresistance of a sensor. In another embodiment, increasing the spacingbetween negative and positive leads of a sensor may increase themeasured resistance of the sensor. In one embodiment, increasing thecontact area of the negative or positive leads of a sensor may reducethe measured resistance of the sensor. In another embodiment, increasingthe number of interdigitated negative and positive leads of the sensormay reduce the measured resistance of the sensor.

FIG. 5 shows a diagram illustrating the placement of electrodes on asensing material (e.g., fabric), in accordance with example embodimentsof the disclosure. In various embodiments, one sensing technique thatmay be implemented as will be shown by diagram 500 may include anelectronic device having sensors may include an electric fieldtomography (EFT) technique. In particular, neighboring sensingelectrodes are used to emit a small AC current. The neighboringelectrode pair may be referred to as a current-projecting pair. Inanother embodiment, voltage differences may be measured across alladjacent electrode pairs in the sensing material of a sensor. Theadjacent electrode pairs may be referred to as voltage-measuring pairs.In another embodiment, a mesh of cross-sectional measurements may beused to determine a location on the sensing material that corresponds toa local shunting of the resistance level, for example, based on a user'stouch.

In particular, as shown in diagram 500 the electrode pair 508 may beplaced externally or internally on a portion of an electronic devicecomprising a sensing material 504 such as a conductive fabric. Further,an electrode pair (e.g., any two electrodes 508 shown in diagram 500)may be used to emit a signal (e.g., an AC current using a currentprojector 506), which may then be measured across the remainingelectrode pairs of the electronic device (e.g., measured using a voltagemeasuring unit 502). This process may be repeated in series or inparallel using the remaining electrodes of the electronic device therebycreating a network of signals which can be used to determine thelocation (e.g., a calculated position 512) of a perturbation (e.g., atouch resulting from a point of contact 510) on the sensing material.

FIG. 6 shows another diagram illustrating the placement of electrodes ona sensing material (e.g., fabric), in accordance with exampleembodiments of the disclosure. In an embodiment, an electric impedancetomography (EIT) technique may be implemented to determine the locationof the perturbation on the sensing material. For example, one or moreelectrode pairs on the electronic device may measure the localresistance of the region they are on the sensor. Further, a matrix ofresistance measurements may be made by arranging the electrode pairs ona single-sheet of conductive material. In one embodiment, a perturbationto the conductive material (e.g., a conductive fabric) may result in alocal resistance change, which may be measured by the matrix ofelectrodes. In various embodiments, the coordinates of each electrode,along with their measurement value may be used to locate the precisearea of perturbation.

In particular, as shown in diagram 600, electrode pairs and relatedpressure/bend/stretch sensors 606 may be used to measure the localresistance in a local area of sensing 604 either from one or more of adeformation of the sensing material 602 resulting from one or more of anapplied pressure, bending force, stretching force, combinations thereof,and/or the like. In another embodiment, the local sensing area 604 maybe used to triangulate (e.g., determine a calculated position 610) thelocation of perturbation (e.g., point of contact 608) on the sensingmaterial 602.

FIG. 7 shows an example diagram of an application of the electronicdevices described herein, in accordance with example embodiments of thedisclosure. In another embodiment, a radio frequency distance tomography(RFDT) technique may be implemented to determine the location of variousposition of a body part. In particular, RF transceiver devices arefixated on certain areas of clothing. In one embodiment, the devices mayinclude inertial measurement units (IMUs). In another embodiment, amaster RF transceiver device may be positioned on a location that doesnot move relative to the other RF modules of the assembly. Further, RSSIsignal may be captured from all other RF signal generators of the otherRF devices, yielding a distance measurement between devices. Further,the RSSI values may be sent to the master RF transceiver device, where amesh network of RSSI values may be calculated to determine the relativeposition of each RF module to the master RF module.

In particular, diagram 700 shows an application of an assembly ofelectronic devices in tracking a body part of a user, such as the handof a user. In another embodiment, a first (master) radio frequency (RF)device/module 704 may be placed on the wrist, as an example, which mayserve as a fixed reference point 706 for the assembly. Moreover, aplurality of RF modules/devices 702 may be coupled to the fingers, orany portion of the body of the user. Further, received signal strengthindication (RSSI) signals 708 may be generated and read from each RFdevice on the fingers. In another embodiment, the RSSI signals 708 maybe transferred to the RF device 704, which may then determine (e.g., viatriangulation) the relative position 714 of each RF device 710 relativeto the first RF device 712.

FIG. 8 shows a diagram 800 of electrode 808 arrangements with respect toa sensing material 804, in accordance with example embodiments of thedisclosure. In particular, a traditional configuration 802 of sensingunits 806 and electrodes 808 is shown and an alternative custom design810 of sensing units 806 on fabric 812 (e.g., another sensing materialexample) is shown.

In particular, in one embodiment, as shown in diagram 802, designconstraints may lead to the electrodes being placed on the exterior ofthe sensing material 804 in connection with the sensing units 806 of anelectronic device. In another embodiment 810, using various fabricdesign tools such as vinyl cutting tools, or sewing electrodes can beirregularly placed with custom dimensions in order to control forsensitivity and adjust for local area effects in garments (such as extralayers, different materials, combinations thereof, and/or the like).

In various embodiments, as noted, the electrodes 808 can be fabricatedin different topologies and arrangements using vinyl cutting techniques,embroidery of conductive fabrics, using thin-sheet conductive metals,combinations thereof, and/or the like. In another embodiment, thesensing material 804 may include fabric, rather than metal sheets,conductive polymers, or glass. In one embodiment, the electrodes 808 maynot need to be on the perimeter of the sensing conductive material.Rather, the electrodes 808 can be made to contact internal areas of thesensing conductive material. In various embodiments, the intensity ofthe signals can be weighted depending on various electrode parametersincluding, but not limited to, the size, conductivity, and surface areaof the electrode. Such parameters may be controlled using computerizedtechniques including, but not limited to, vinyl cutting or CNCembroidery.

FIG. 9 shows diagrams depicting different configurations for theelectrode leads associated with a given portion of the sensor, inaccordance with example embodiments of the disclosure. In particular, ina first embodiment as shown in diagram 910, the sensor may include afirst electrode 902 that may be placed below a sensing material 903, anda second electrode 904 that may be placed above the sensing material903. In another embodiment as shown in diagram 912 the sensor mayinclude a configuration where the first electrode 906 and the secondelectrode 908 are both placed above or below the sensing material 907.

FIG. 10 shows diagrams that describe the coupling of a sensing materialand a portion of an article of clothing, in accordance with exampleembodiments of the disclosure. In a first embodiment, diagram 1010 showsthe sensing material 1002 (e.g., a sensing material including aconductive fabric). Further, diagram 1010 shows the portion of clothing1003. Moreover, the leads for the first electrode E1 and the secondelectrode E2 may be formed on the portion of clothing in any suitablepattern, such as the pattern 1004 shown in diagram 1010. Moreover, asshown in diagram 1012, the sensing material 1002 may be coupled (e.g.,mechanically coupled) to the portion of clothing 1003, at leastpartially enclosing the electrodes E1 and E2. In one example, thesensing material 1002 may be configured to be sown onto the portion ofclothing 1003, for example, along the periphery of the portion ofclothing 1003. In an embodiment, the sensing material 1002 may be madeof any suitable material such that it can be laminated (e.g., ironed)onto the portion of clothing with the application of heat, pressure, orboth. In yet another embodiment, the sensing material 1002 may becoupled to the portion of clothing 1003 using any suitable techniqueincluding combinations of sewing and lamination, or the like.

FIG. 11A shows diagrams that describe another aspect of the coupling ofa sensing material and a portion of an article of clothing, inaccordance with example embodiments of the disclosure. In a firstembodiment, diagram 1101 shows the sensing material 1102 (e.g., asensing material including a conductive fabric). Further, diagram 1101shows a first portion of clothing 1104 and a second portion of clothing1106. Moreover, the leads for the first electrode E1 and the secondelectrode E2 may be formed on the first portion of clothing 1104 and thesecond portion of clothing 1106, respectively, the electrode leadshaving any suitable pattern.

As shown in diagram 1103, the sensing material 1102 may be coupled(e.g., mechanically coupled) to the first portion of clothing 1104, atleast partially enclosing electrode E1. In one example, the sensingmaterial 1102 may be configured to be sown onto the first portion ofclothing 1104, for example, along the periphery of the first portion ofclothing 1104. In an embodiment, the sensing material 1102 may be madeof any suitable material such that it can be laminated (e.g., ironed)onto the portion of clothing with the application of heat, pressure, orboth. In yet another embodiment, the sensing material 1102 may becoupled to the first portion of clothing 1104 using any suitabletechnique including combinations of sewing and lamination, or the like.Additionally, the first portion of clothing 1104 and the second portionof clothing 1106 may be positioned across a fold 1108.

As shown in diagram 1105, the sensing material 1102 may be sandwichedbetween the first portion of clothing 1104 and the second portion ofclothing 1106 after folding 1109 the second portion of clothing 1106over the fold 1108 of diagram 1103, as indicated in diagram 1105. Thefolding 1109 may be performed by a machine or by a human, using anysuitable technique.

As shown in diagram 1107, the result of the folding 1109 that occurs indiagram 1105 may result in a structure having the cross-sectional viewdepicted in the diagram. In particular, the diagram 1107 shows that thesensing material 1102 may be sandwiched between the second portion ofclothing 1106 and the first portion of clothing 1104. Moreover, theelectrodes E1 and E2 are shown; in particular, the first electrode E1may be configured between the second portion of clothing 1106 and thesensing material 1102, while the second electrode E2 may be configuredbetween the sensing material 1102 and the first portion of clothing1104.

FIG. 11B shows diagrams that describe yet another aspect of the couplingof a sensing material and a portion of an article of clothing, inaccordance with example embodiments of the disclosure. In particular,diagram 1121 shows the sensing material 1102 (e.g., a sensing materialincluding a conductive fabric) that may be sewn 1122 onto a firstportion of clothing 1104. Moreover, the leads for the first electrode E1and the second electrode E2 may be formed on the first portion ofclothing 1104, the electrode leads having any suitable pattern. Diagram1123 shows the second portion of clothing 1106 that may be coupled tothe first portion of clothing 1104 having the sensing material 1102, forexample, by sewing 1124. Accordingly, diagram 1125 shows one perspectiveview of the final structure of the sensor, where the sensing material1102 has been sandwiched by the first portion of clothing 1104 and thesecond portion of clothing 1106. Additionally, diagram 1127 shows thatthe sensing material 1102 may be sandwiched between the second portionof clothing 1106 and the first portion of clothing 1104. Moreover, theelectrodes E1 and E2 are shown; in particular, the first electrode E1and the second electrode may be configured between sensing material 1102and the first portion of clothing 1104.

FIG. 11C shows diagrams that describe yet another aspect of the couplingof a sensing material and a portion of an article of clothing, inaccordance with example embodiments of the disclosure. In contrast tothe diagrams of FIG. 11B, the diagrams of FIG. 11C show a configurationwhere the electrodes are placed vertically apart instead of horizontallyapart. Additionally, the sensors may be offset from one another (e.g.,not necessarily be aligned on a vertical plane). In particular, diagram1131 shows the sensing material 1102 (e.g., a sensing material includinga conductive fabric) that may be sewn 1126 onto a first portion ofclothing 1104. Moreover, the first electrode E1 may be formed on thefirst portion of clothing 1104, the first electrode lead having anysuitable pattern. Diagram 1133 shows the second portion of clothing 1106that may be coupled to the first portion of clothing 1104 having thesensing material 1102, for example, by sewing 1128. Accordingly, diagram1135 shows one perspective view of the final structure of the sensor,where the sensing material 1102 has been sandwiched by the first portionof clothing 1104 and the second portion of clothing 1106. Additionally,diagram 1137 shows that the sensing material 1102 may be sandwichedbetween the second portion of clothing 1106 and the first portion ofclothing 1104. Moreover, the electrodes E1 and E2 are shown; inparticular, the second electrode E2 may be configured between the secondportion of clothing 1106 and the sensing material 1102, while the firstelectrode E1 may be configured between the sensing material 1102 and thefirst portion of clothing 1104. As noted, the electrodes E1 and E2 mayhave a horizontal displacement from one another in addition to thevertical displacement.

FIG. 12 shows diagrams 1200 of example connectors that may be used toelectronically couple different regions of conductive or non-conductivematerials 1222 (e.g., conductive fabrics), in accordance with exampleembodiments of the disclosure. For example, the diagrams illustrateexample connectors that may be formed on conductive areas 1226 of theconductive materials. Further, the conductive areas 1226 may beelectronically coupled to one another using conductive threads/wires1224 and 1230, paste, resin or adhesives 1232, or embedded magnets 1228that physically connect two adjacent areas.

In various embodiments, connectors may be used to form connectionbetween areas within a given electronic device (e.g., between sensors ofan electronic device), and/or between different electronic devices. Inanother embodiment, the connections can be directly stitched to theelectronic device and/or the garment that the electronic device is apart of, for example, by using conductive threads and wires. In oneembodiment, portions of conductive materials (e.g., conductive fabrics)can be electronically coupled using an adhesive (e.g., a fabricadhesive) sprayed with a conductive coating (e.g., a carbon-blackmaterial) in order to maintain an electrical connection. In anotherembodiment, any suitable material may be used to fuse the end of theconnectors. For example, a blend of conductive epoxies can be used tofuse the ends of the connectors. In one embodiment, a blend ofconductive paint can be used to fuse the ends of the connectors.Additionally, to maintain connection strength, uncured silicone resincan be applied onto portions of the conductive material (e.g., fabric).In particular, the silicone resin may diffuse between the conductivematerial as the material is cured. In various embodiments, magnets canbe laced onto junctions or connections of at least portions of anelectronic device, for example, at interfaces where external sensors andmodules can be clipped onto the electronic device.

FIG. 13 shows a diagram including a plot of resistance versus conductivelayer thickness, in accordance with example embodiments of thedisclosure. In particular, diagram 1301 shows a front cross-section of athread having a fabric core material enclosed by a conductive layer.Diagram 1303 shows the embedding of such a thread in a fabric, thefabric having a given thread count per unit area, and a number of wiresper thread (e.g., ply count).

Diagram 1305 shows a plot of the change in resistance values of a giventhread having the front cross-sectional area depicted in diagram 1301versus the conductive layer thickness. In particular, as can be seen indiagram 1305, the change in resistance can have a first region thatexhibits resistive characteristics, a second state that exhibits avariable resistance characteristics, which may correspond to a peak ofthe curve in diagram 1305, and a third state that exhibits a conductiveresistive characteristics. Accordingly, the dimensions of the conductivethread may be optimized to have a suitable level of resistivity in orderto generate a suitable measurement of force by the sensor.

FIG. 14 shows a diagram of example plots of sensor characteristics withvarying fabric thickness, in accordance with example embodiments of thedisclosure. In particular, diagram 1401 shows a unitless diagram of thetrend for the output (e.g., output measurement) of the sensor versus theinput (e.g., input force) for a given measurement quantity (e.g.,force). Further, the plot of diagram 1401 indicates that for differentinputs 1, 2, and 3 corresponding to increasing fabric thicknesses,respectively, the output of the sensor may have an increasing dynamicrange, while maintaining a similar sensitivity (e.g., as represented bythe slopes of the lines of diagram 1401). Diagram 1403 shows the generaltrends for the output (e.g., output measurement of the sensor (in unitsof percent) versus time (e.g., in a given unit of time such asmilliseconds, depending on the exact geometry and materials of thesensor). Further, the plot diagram 1403 shows that for different inputs1, 2, and 3 corresponding to increasing fabric thicknesses,respectively, the output of the sensor may have taken a longer time toreach its final value absent transients (e.g., value corresponding to100% on the output y-axis) for the thicker material thicknesses in thedevice sensors than for thinner materials. In various embodiments, thethickness of the materials may be increased as a result of layeringmultiple materials, increasing the thread diameter (e.g., as shown anddescribed in connection with FIG. 13, above), stacking sensor devices,combinations thereof, and/or the like.

FIG. 15 shows a diagram of example plots of sensor characteristics withvarying sensing material (e.g., conductive fabric) density (e.g., fromsparse to dense), in accordance with example embodiments of thedisclosure. In particular, diagram 1501 shows a unitless diagram of thetrend for the output (e.g., output measurement) of the sensor versus theinput (e.g., input force) for a given measurement quantity (e.g.,force). Further, the plot of diagram 1501 indicates that for differentinputs 1, 2, and 3 corresponding to increasing sensing material density,respectively, the output of the sensor may have an increasingsensitivity (e.g., represented by the slope of the lines diagram 1501),while maintaining a similar dynamic range. Diagram 1503 shows thegeneral trends for the output (e.g., output measurement of the sensor(in units of percent) versus time (e.g., in a given unit of time such asmilliseconds, depending on the exact geometry and materials of thesensor). Further, the plot diagram 1503 shows that for different inputs1, 2, and 3 corresponding to increasing sensing material density,respectively, the output of the sensor may take a shorter time to reachits final value absent transients (e.g., value corresponding to 100% onthe output y-axis) for the denser sensing materials in the devicesensors than for less dense sensing materials.

FIG. 16 shows a diagram of example plots of sensor characteristics withvarying sensing material (e.g., conductive fabric) elasticity (e.g.,from relatively stiff to elastic), in accordance with exampleembodiments of the disclosure. In particular, diagram 1601 shows aunitless diagram of the trend for the output (e.g., output measurement)of the sensor versus the input (e.g., input force) for a givenmeasurement quantity (e.g., force). Further, the plot of diagram 1601indicates that for different inputs 1 and 2 corresponding to stiff andelastic, respectively, the output of the sensor may have a similarsensitivity (e.g., represented by the slope of the lines diagrams 1601),while having a different dynamic range (e.g., greater dynamic range forthe elastic material as compared with the stiff material). Diagram 1603shows the general trends for the output (e.g., output measurement of thesensor (in units of percent) versus time (e.g., in a given unit of timesuch as milliseconds, depending on the exact geometry and materials ofthe sensor). Further, the plot diagram 1603 shows that for differentinputs 1 and 2 corresponding to increasing sensing material elasticityfrom stiff to elastic, respectively, the output of the sensor may take ashorter time to reach its final value absent transients (e.g., valuecorresponding to 100% on the output y-axis) for the stiffer sensingmaterials in the device sensors than for more elastic sensing materials.

FIG. 17 shows example diagrams of example sensing mechanisms of theelectronic devices described herein, in accordance with exampleembodiments of the disclosure. In particular, diagram 1702 shows anexample pressure sensing mechanism. In one embodiment, diagram 1704shows an example acceleration (m/s²) sensing mechanism. In anotherembodiment, diagram 1706 shows a gyration measurements (degrees/s)sensing mechanism. In another embodiment, diagram 1712 indicates thatthe acceleration and gyration measurements of the previous diagrams maybe used to determine Euclidean angle by any suitable algorithm, forexample, using an altitude and heading reference (AHRS) algorithm,including, but not limited to, a MahonyAHRS and/or a MadgwickAHRSalgorithm. In one embodiment, diagram 1708 shows how pressure data canbe visualized on an in-sole graphical heatmap. Alternatively, oradditionally, data can be monitored numerically, for example, at a userdevice (e.g., a mobile phone) and at the user's discretion. In variousembodiments, diagram 1714 shows a combination of acceleration, gyration,and Euclidean angle measurements as described above may be used to modelthe speed and/or orientation of the sole of a user in real-time or innear real-time.

In various embodiments, diagrams represent example techniques that maybe used to acquire real-time gait and motion analysis using the wearableelectronic devices described herein. In particular, a first set ofsensors may be positioned strategically proximate to a given area of thebody (e.g., the foot), and the set of sensors may be used to determinethe motion of the given area body of the body (e.g., the foot, head,arm, etc.). In various embodiments, accelerometers and gyrometers may beused to capture motion in the form of 3-dimensional spatial data. In oneembodiment, another second set of sensors (e.g., pressure, bend, andstretch sensors) may be arranged proximate to the given area of the bodysuch that the sensors provide a 2-dimensional representation of movementand weight distribution of the body part on the sensors. Combined, thesetwo sets of sensors may be used to determine the motion and movementpatterns of the given area of the body. For example, the two sets ofsensors may be used to determine the motion and/or gait patterns of agiven user.

In various aspects, embodiments of the disclosure may be used todetermine usage patterns of wearable electronic devices (e.g.,electronic devices having pressure sensors). In one embodiment,electronic devices may include pressure sensitive materials (e.g.,pressure sensitive fabrics), and wearable electronic devices may be usedto sense intensity of a given motion by a given user. For example, for afirst application, an electronic device may include a matrix of pressuresensitive pads in the shoe or sock to detect various parameters of auser's motion, including, but not limited to, foot placement, areas ofimpact, weight distribution, and time of impact and lift-off during agait cycle, combinations thereof, and/or the like. In another example, asecond application involving user's hands, an electronic device may beused, for example, to detect one or more of a grip strength, afinger/hand placement, pressure distribution among finger digits,combinations thereof, and/or the like. In further examples, anelectronic device may be placed in the lining of clothing of a user maybe used to detect level of fit, for example, whether a given article ofclothing is too tight or too loose against the body of a user. Infurther embodiments, the electronic device may include one or morepressure sensors that may be positioned in a given article of clothingto detect deformation, body contortion, an amount of bend andflexibility, combinations thereof, and/or the like.

In various embodiments, one or more inertial measurement units (IMUs)may be used in connection with the disclosed electronic devices. In oneembodiment, IMUs may include devices that may measure forces applied tothe body, including, but not limited to, accelerative forces, angularforces, magnetic forces, barometric forces, combinations thereof, and/orthe like. In particular, IMUs may include accelerometers and gyrometersto capture the acceleration and gyration of a moving body, for example,the rate of change in speed and angle of a body in motion. Further, eachmeasurement of such sensors may be provided with reference to a 3-axiscoordinate system (e.g., x, y, and z), with each axis providing a degreeof freedom (DOF) for movement to be measured. In various embodiments, bycombining both acceleration and gyration measurements, the IMU mayprovide a 6 DOF measurement. Such a measurement may be used by theelectronic device to determine the Euler angles of a given body, therebycomputing the orientation of the body in space at a particular time.

FIG. 18 shows an example diagram 1800 of an article of clothingincluding various components described herein, in accordance withexample embodiments of the disclosure. In various embodiments, thecomponents may include, but not be limited to, sensors, signalprocessing devices, logic devices, peripheral device controls, and thelike. The component may be contained in a custom board and placed in aportion of the article of clothing such as in the tongue of the shoe, oranywhere that is comfortable for the user. In particular, diagram 1800shows a shoe that may include at least three components: amicrocontroller device 1804, a radio frequency (RF) device 1806, and abattery device 1808. In one aspect, the RF device may include a deviceconfigured to transmit and receive information based on a wirelessconnection (e.g., WiFi, Bluetooth, cellular, etc.) and may be placed inthe back of the shoe, or anywhere that is comfortable for the user yetstill externally accessible. In one embodiment, the battery device mayinclude a battery pack that may be rechargeable through inductivecharging, and the battery device may be placed at the base or sole ofthe shoe. In another embodiment, the components may be strategicallyplaced in the shoe to maximize utilization and minimize user discomfort.

Hardware architecture & design considerations are described as follows.In particular, a circuitry with respects to shoe architecture may be anexample design. In particular, hardware devices may include themicrocontroller 1804. The hardware architecture consists of acentralized microcontroller that reads data from peripheral sensors suchas the pressure and IMU devices 1802. Once the data is read, processed,and formatted into readable and usable data, the data is thentransmitted via a radio frequency (RF) device 1806 to a specifiedreceiver such as a server or personal computer in order to store andfurther process aggregated amounts of user data. In order to power thissystem, a rechargeable battery 1808 should provide enough voltage andcurrent to provide enough power to sustain the system for hours at atime. Finally, these components can be strategically fitted into theshoe 1810, where the larger items such as the battery can be embeddedinto the sole-heel where it is easily accessible through inductivecharging, and the microcontroller and remaining circuitry can bedistributed to the tongue or back of the shoe.

FIG. 19 shows a diagram 1900 representing an example flow ofcommunication and data between the disclosed electronic devices and oneor more peripheral device, in accordance with example embodiments of thedisclosure. In various embodiments, data can be offloaded from anelectronic device by wired or wireless connections 1902. In oneembodiment, wired connections (e.g., USB) may be used to download thedata to another computer or application for offline processing 1908. Inanother embodiment, a wireless connection 1910 may use any suitable airinterface (e.g., WiFi, Bluetooth, etc.) to transfer data to anotherdevice such as an online server or application for data processing. Invarious embodiments, the offloaded data can be stored, analyzed, andshared using multiple online and offline methods 1904. In anotherembodiment, the data can be transferred to an app on the user's phone1912. Alternatively, or additionally, the data can be uploaded andtransferred via USB 1916. In further aspects, the data may be stored inthe cloud 1914. Moreover, the data can be managed and analyzed using aserver 1906 running one or more artificial intelligence (AI)-basedalgorithms to monitor data from an article of clothing having theelectronic device(s), such as a shoe.

In various embodiments, the communication stack is described. In variousembodiments, data collected by the electronic devices from theenvironment may be converted to electrical signals from the sensors ofthe electronic devices. Such data may then be transmitted to amicrocontroller where it is processed into meaningful mathematicalquantities. In one embodiment, the data may be sent to a written harddisk, or may be wirelessly transmitted to a local or personal server forfurther data aggregation and analysis. In particular, large data sets(e.g., high dimensional data sets) may be systematically generated bythe sensors but may be computationally difficult to model withdefinitive mathematical functions that describe a state associated withthe data (e.g., a walking or jumping state associated with sensor data).Accordingly, such large data sets may be used in connection with one ormore machine learning applications where iterative reinforced learningalgorithms can supply latent variables that are helpful in forming apredictive model describing the data. In one embodiment, machinelearning algorithms may be used to design an AI system that learns froma user's motion and recognizes patterns or changes in the user'smovement or gait. The AI algorithm may be used for tracking a user'sperformance, whether for athletic purposes like in sports training, orfor tracking regular routines such as bending or stretching.

As discussed, the devices may be configured to run one or more AI-basedalgorithms. Such artificial intelligence (AI) to facilitate automatingone or more features described herein. The components can employ variousAI-based schemes for carrying out various embodiments and/or examplesdisclosed herein. To provide for or aid in the numerous determinations(e.g., determine, ascertain, infer, calculate, predict, prognose,estimate, derive, forecast, detect, compute) described herein,components described herein can examine the entirety or a subset of thedata to which it is granted access and can provide for reasoning aboutor determine states of the system, environment, etc. from a set ofobservations as captured via events and/or data. Determinations can beemployed to identify a specific context or action, or can generate aprobability distribution over states, for example. The determinationscan be probabilistic; that is, the computation of a probabilitydistribution over states of interest based on a consideration of dataand events. Determinations can also refer to techniques employed forcomposing higher-level events from a set of events and/or data.

Such determinations can result in the construction of new events oractions from a set of observed events and/or stored event data, whetherthe events are correlated in close temporal proximity, and whether theevents and data come from one or several event and data sources (e.g.,different sensor inputs). Components disclosed herein can employ variousclassification (explicitly trained (e.g., via training data) as well asimplicitly trained (e.g., via observing behavior, preferences,historical information, receiving extrinsic information, etc.) schemesand/or systems (e.g., support vector machines, neural networks, expertsystems, Bayesian belief networks, fuzzy logic, data fusion engines,etc.) in connection with performing automatic and/or determined actionin connection with the claimed subject matter. Thus, classificationschemes and/or systems can be used to automatically learn and perform anumber of functions, actions, and/or determinations.

A classifier can map an input attribute vector, z=(z₁, z₂, z₃, z₄, . . ., z_(n)), to a confidence that the input belongs to a class, as byf(z)=confidence(class). Such classification can employ a probabilisticand/or statistical-based analysis (e.g., factoring into the analysisutilities and costs) to determinate an action to be automaticallyperformed. A support vector machine (SVM) can be an example of aclassifier that can be employed. The SVM operates by finding ahyper-surface in the space of possible inputs, where the hyper-surfaceattempts to split the triggering criteria from the non-triggeringevents. Intuitively, this makes the classification correct for testingdata that is near, but not identical to training data. Other directedand undirected model classification approaches include, for example,naïve Bayes, Bayesian networks, decision trees, neural networks, fuzzylogic models, and/or probabilistic classification models providingdifferent patterns of independence can be employed. Classification asused herein also is inclusive of statistical regression that is utilizedto develop models of priority.

FIG. 20 shows diagrams of example applications for the disclosedelectronic devices, in accordance with example embodiments of thedisclosure. In particular, FIG. 20 shows example applications forpressure and IMU sensing shoe technology. Diagram 2002 shows an examplewhere the electronic devices may be used to determine the degree of tiltin a user's posture when idle or in motion. In particular, the degree oftilt may be indicative of degraded neurological activity of musclecontrol which manifest in poor balance. Diagram 2004 shows an examplewhere the electronic devices may be used to determine a user's steppinggait, which can also reveal a degree of imbalance, poor muscle control,and overall degraded neurological control. On a more granular level,diagram 2006 shows an example where the electronic devices may be usedto determine the weight distribution on a foot. This weight distributionmay be used to determine signs of poor balance and muscle control, andwhen compared to healthy patients can provide detailed information aboutthe user's level of neurological and bodily control.

As noted, embodiments of the disclosure may be used in connection withone or more machine learning and AI algorithms. In particular, a givenuser may have a unique range of motion and gait which can be attributedto one or more factors including, but not limited to, age, level ofexercise, diet, and a variety of other physiological and externalfactors. In one embodiment, by determining quantifiable and highfidelity motion data using the disclosed electronic devices, a reverseanalysis of a given user may be performed, that is, by knowing a user'smotion data and gait performance, a trained professional or AI platformmay be used to estimate the level of health or athletic condition of theuser. For example, an Olympic athlete may have a different runningstyle, posture, and range of motion, and the like than an average user.Such a distinction may be more apparent when comparing trained athletesto overweight or out-of-shape users. Such distinctions may bequalitatively measured through high-resolution videos andmotion-captured images where they are meticulously analyzed by trainedphysical therapist and sports analyst. However, using the disclosedelectronic devices, human motion can be captured in real time ornear-real time and at higher quality without the use of expensivehigh-speed cameras and engineered rooms. Further, by using one or moreAI-based algorithms, the human motions may be used in addition to or inplace of subjective professional observations to increase the accuracyof analyses.

In various aspects, embodiments of the disclosure may be used inconnection with healthcare sciences. In particular, neurologicaldiseases may include one or more physical symptoms correlated toneurological degradation. For example, users suffering from Alzheimer'sdisease, Parkinson's disease, Huntington's disease, and the like maymanifest poor physical outcomes such as debilitated walking, weakness,imbalance, and shakiness. Such physical symptoms may be difficult todetect at the onset, that is, during the beginnings of neurologicaldamage; however, the symptoms may become severe and noticeable at laterstages. Accordingly, conventional diagnostics of neurological diseasesmay rely on high-end and expensive measurements such as CT, MRI, orphysical probing using EMG, EEG, and NCV scans. Moreover, physicalassessment, even by trained professionals, may be subjective,inconsistent, and/or error-prone.

In various aspects, embodiments of the disclosure may offer the abilityto detect the onset of neurological disorders by analyzing one or morechanges in motion and gait patterns. For example, by tracking the dailymotion and/or the walking patterns of the user, and analyzing this datausing one or more AI-based algorithms that are configured to detect cuesassociated with motion impairment, embodiments of the disclosure may beused to predict the onset of neurological disorders and provide feedbackto the user. Thereby, rather than seeing a doctor at discrete points intime, a patient can go on with their normal routine, as walking andmoving may provide sufficient data to the AI-based algorithms to discernchanges in physical function. Further, noticeable changes may beanalyzed by the AI-based algorithms and communicated to the user and/ordoctors for more thorough analysis.

In various aspects, embodiments of the disclosure may be used inconnection with athletics application. In particular, athletic fieldsare using more devices that may serve to aid in providing athleticassessment, feedback, and quantitative measurements of performance tousers. Many athletic devices are peripheral as they are added to areasthat are most comfortable rather than more functional. Examples of suchathletic devices include smart watches, phones, and belt/clothingclip-ons. Some of these device may be unable to perform on-site datacollection. For example, for phones and smart watches, counting stepsmay require multiple devices and sophisticated algorithms to indirectlymonitor foot motions. In contrast, the disclosed electronic devices mayalready be placed in a given article of clothing such as a shoe, andthereby, making certain measurements such as step counts may performedin a more straightforward fashion. Accordingly, creating wearableelectronics in the shoe that are comfortable opens a new arena ofaccurate and direct measurement of one or more gait, speed, step count,running style combinations thereof, and/or the like, which may not beeasily and/or directly measured with a phone or watch located at adistance (e.g., a body's length) way from the measurement site (e.g., afoot of a user).

FIG. 21 shows an example flow diagram 2100 that may represent aspects ofthe fabrication of the electronic devices described herein, inaccordance with example embodiments of the disclosure. At block 2102, afirst layer may be provided serving as a flexible support material. Atblock 2104, a second layer may be disposed on the first layer, thesecond layer serving as a sensing material. At block 2106, a third layermay be disposed on the second layer, the third layer comprising aninsulating material. At block 2108, the second layer and the third layermay be coupled using a first electrode comprising a first conductivethread and a first non-conductive thread, the first conductive threadembedded in the second layer. At block 2110, the first layer and thesecond layer may be coupled using a second electrode comprising a secondconductive thread and a second non-conductive thread, the secondconductive thread embedded in the second layer.

In another embodiment, a fourth layer may be disposed on the firstlayer, the fourth layer serving as a second sensing material. In oneembodiment, the third layer may be disposed on the fourth layer, thethird layer comprising the insulating material. In another embodiment,the fourth layer and the third layer may be coupled using a thirdelectrode comprising a third conductive thread and a thirdnon-conductive thread, the third conductive thread embedded in thefourth layer. In one embodiment, the fourth layer and the first layermay be coupled using a fourth electrode comprising a fourth conductivethread, the fourth conductive thread embedded in the first layer and thefourth layer. Further, a cross-sectional shape of the electrodes and/ora spacing between two or more electrodes may be performed to increase aresponse time, an input dynamic range, an output dynamic range, and/or asensitivity of the sensor. In some embodiments, the sensor is a firstsensor, and the method further includes fabricating a second sensorspaced laterally from the first sensor along a common horizontal axis ora common vertical axis.

In various embodiments, electrospinning/spraying and spray painting maybe used to fabricate the devices described herein. In particular, suchtechniques may aerosolizes conductive materials (metals or conductivepolymers) and embed them into a porous medium (in this case, a fabric orthread) through electrostatic interactions (applying a voltage, chargingthe fabric/thread and the aerosolized material with the oppositecharge). Alternatively, or additionally, screen printing may beperformed to generate the devices described herein. In particular, airpressure (spray painting), or force applied to a liquid slurry of theaerosolized conductive materials in order to paint the materials on thefabric may be used to create at least portions of the devices describedherein.

Another approach in fabrication may include usingelectrospinning/spraying or spray painting to spray on the electrodes.Connections can be joined using the sewing technique already specifiedin this disclosure.

As mentioned, one or more databases used in connection with thedisclosure can include a database stored or hosted on a cloud computingplatform. It is to be understood that although this disclosure includesa detailed description on cloud computing, implementation of theteachings recited herein are not limited to a cloud computingenvironment. Rather, embodiments of the present invention are capable ofbeing implemented in conjunction with any other type of computingenvironment now known or later developed.

Cloud computing is a model of service delivery for enabling convenient,on-demand network access to a shared pool of configurable computingresources (e.g., networks, network bandwidth, servers, processing,memory, storage, applications, virtual machines, and services) that canbe rapidly provisioned and released with minimal management effort orinteraction with a provider of the service. This cloud model may includeat least five characteristics, at least three service models, and atleast four deployment models.

Characteristics are as follows:

On-demand self-service: a cloud consumer can unilaterally provisioncomputing capabilities, such as server time and network storage, asneeded automatically without requiring human interaction with theservice's provider.

Broad network access: capabilities are available over a network andaccessed through standard mechanisms that promote use by heterogeneousthin or thick client platforms (e.g., mobile phones, laptops, and PDAs).

Resource pooling: the provider's computing resources are pooled to servemultiple consumers using a multi-tenant model, with different physicaland virtual resources dynamically assigned and reassigned according todemand. There is a sense of location independence in that the consumergenerally has no control or knowledge over the exact location of theprovided resources but may be able to specify location at a higher levelof abstraction (e.g., country, state, or datacenter).

Rapid elasticity: capabilities can be rapidly and elasticallyprovisioned, in some cases automatically, to quickly scale out andrapidly released to quickly scale in. To the consumer, the capabilitiesavailable for provisioning often appear to be unlimited and can bepurchased in any quantity at any time.

Measured service: cloud systems automatically control and optimizeresource use by leveraging a metering capability at some level ofabstraction appropriate to the type of service (e.g., storage,processing, bandwidth, and active user accounts). Resource usage can bemonitored, controlled, and reported, providing transparency for both theprovider and consumer of the utilized service.

Service Models are as follows:

Software as a Service (SaaS): the capability provided to the consumer isto use the provider's applications running on a cloud infrastructure.The applications are accessible from various client devices through athin client interface such as a web browser (e.g., web-based e-mail).The consumer does not manage or control the underlying cloudinfrastructure including network, servers, operating systems, storage,or even individual application capabilities, with the possible exceptionof limited user-specific application configuration settings.

Platform as a Service (PaaS): the capability provided to the consumer isto deploy onto the cloud infrastructure consumer-created or acquiredapplications created using programming languages and tools supported bythe provider. The consumer does not manage or control the underlyingcloud infrastructure including networks, servers, operating systems, orstorage, but has control over the deployed applications and possiblyapplication hosting environment configurations.

Infrastructure as a Service (IaaS): the capability provided to theconsumer is to provision processing, storage, networks, and otherfundamental computing resources where the consumer is able to deploy andrun arbitrary software, which can include operating systems andapplications. The consumer does not manage or control the underlyingcloud infrastructure but has control over operating systems, storage,deployed applications, and possibly limited control of select networkingcomponents (e.g., host firewalls).

Deployment Models are as follows:

Private cloud: the cloud infrastructure is operated solely for anorganization. It may be managed by the organization or a third party andmay exist on-premises or off-premises.

Community cloud: the cloud infrastructure is shared by severalorganizations and supports a specific community that has shared concerns(e.g., mission, security requirements, policy, and complianceconsiderations). It may be managed by the organizations or a third partyand may exist on-premises or off-premises.

Public cloud: the cloud infrastructure is made available to the generalpublic or a large industry group and is owned by an organization sellingcloud services.

Hybrid cloud: the cloud infrastructure is a composition of two or moreclouds (private, community, or public) that remain unique entities butare bound together by standardized or proprietary technology thatenables data and application portability (e.g., cloud bursting forload-balancing between clouds).

A cloud computing environment is service oriented with a focus onstatelessness, low coupling, modularity, and semantic interoperability.At the heart of cloud computing is an infrastructure that includes anetwork of interconnected nodes.

The present invention may be a system, a method, and/or a computerprogram product at any possible technical detail level of integration.The computer program product may include a computer readable storagemedium (or media) having computer readable program instructions thereonfor causing a processor to carry out aspects of the present invention.The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Smalltalk, C++, or the like, and procedural programminglanguages, such as the “C” programming language or similar programminglanguages. The computer readable program instructions may executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer may be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection may be made to anexternal computer (for example, through the Internet using an InternetService Provider). In some embodiments, electronic circuitry including,for example, programmable logic circuitry, field-programmable gatearrays (FPGA), or programmable logic arrays (PLA) may execute thecomputer readable program instructions by utilizing state information ofthe computer readable program instructions to personalize the electroniccircuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the blocks may occur out of theorder noted in the Figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

In order to provide a context for the various aspects of the disclosedsubject matter, FIG. 22 as well as the following discussion are intendedto provide a general description of a suitable environment in which thevarious aspects of the disclosed subject matter can be implemented. FIG.22 illustrates a block diagram of an example, non-limiting operatingenvironment 2200 in which one or more embodiments described herein canbe facilitated. Repetitive description of like elements employed inother embodiments described herein is omitted for sake of brevity. Withreference to FIG. 22, a suitable operating environment 2200 forimplementing various aspects of this disclosure can include a computer2212. The computer 2212 can also include a processing unit 2214, asystem memory 2216, and a system bus 2218. The system bus 2218 canoperably couple system components including, but not limited to, thesystem memory 2216 to the processing unit 2214. The processing unit 2214can be any of various available processors. Dual microprocessors andother multiprocessor architectures also can be employed as theprocessing unit 2214. The system bus 2218 can be any of several types ofbus structures including the memory bus or memory controller, aperipheral bus or external bus, and/or a local bus using any variety ofavailable bus architectures including, but not limited to, IndustrialStandard Architecture (ISA), Micro-Channel Architecture (MSA), ExtendedISA (EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB),Peripheral Component Interconnect (PCI), Card Bus, Universal Serial Bus(USB), Advanced Graphics Port (AGP), Firewire, and Small ComputerSystems Interface (SCSI). The system memory 2216 can also includevolatile memory 2220 and nonvolatile memory 2222. The basic input/outputsystem (BIOS), containing the basic routines to transfer informationbetween elements within the computer 2212, such as during start-up, canbe stored in nonvolatile memory 2222. By way of illustration, and notlimitation, nonvolatile memory 2222 can include read only memory (ROM),programmable ROM (PROM), electrically programmable ROM (EPROM),electrically erasable programmable ROM (EEPROM), flash memory, ornonvolatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM).Volatile memory 2220 can also include random access memory (RAM), whichacts as external cache memory. By way of illustration and notlimitation, RAM is available in many forms such as static RAM (SRAM),dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM(DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), directRambus RAM (DRRAM), direct Rambus dynamic RAM (DRDRAM), and Rambusdynamic RAM.

Computer 2212 can also include removable/non-removable,volatile/non-volatile computer storage media. FIG. 22 illustrates, forexample, a disk storage 2224. Disk storage 2224 can also include, but isnot limited to, devices like a magnetic disk drive, floppy disk drive,tape drive, Jaz drive, Zip drive, LS-100 drive, flash memory card, ormemory stick. The disk storage 2224 also can include storage mediaseparately or in combination with other storage media including, but notlimited to, an optical disk drive such as a compact disk ROM device(CD-ROM), CD recordable drive (CD-R Drive), CD rewritable drive (CD-RWDrive) or a digital versatile disk ROM drive (DVD-ROM). To facilitateconnection of the disk storage 2224 to the system bus 2218, a removableor non-removable interface can be used, such as interface 2226. FIG. 22also depicts software that can act as an intermediary between users andthe basic computer resources described in the suitable operatingenvironment 2200. Such software can also include, for example, anoperating system 2228. Operating system 2228, which can be stored ondisk storage 2224, acts to control and allocate resources of thecomputer 2212. System applications 2230 can take advantage of themanagement of resources by operating system 2228 through programcomponents 2232 and program data 2234, e.g., stored either in systemmemory 2216 or on disk storage 2224. It is to be appreciated that thisdisclosure can be implemented with various operating systems orcombinations of operating systems. A user enters commands or informationinto the computer 2212 through one or more input devices 2236. Inputdevices 2236 can include, but are not limited to, a pointing device suchas a mouse, trackball, stylus, touch pad, keyboard, microphone,joystick, game pad, satellite dish, scanner, TV tuner card, digitalcamera, digital video camera, web camera, sensors mentioned above, andthe like. These and other input devices can connect to the processingunit 2214 through the system bus 2218 via one or more interface ports2238. The one or more Interface ports 2238 can include, for example, aserial port, a parallel port, a game port, and a universal serial bus(USB). One or more output devices 2240 can use some of the same type ofports as input device 2236. Thus, for example, a USB port can be used toprovide input to computer 2212, and to output information from computer2212 to an output device 2240. Output adapter 2242 can be provided toillustrate that there are some output devices 2240 like monitors,speakers, and printers, among other output devices 2240, which requirespecial adapters. The output adapters 2242 can include, by way ofillustration and not limitation, video and sound cards that provide ameans of connection between the output device 2240 and the system bus2218. It should be noted that other devices and/or systems of devicesprovide both input and output capabilities such as one or more remotecomputers 2244.

Computer 2212 can operate in a networked environment using logicalconnections to one or more remote computers, such as remote computer2244. The remote computer 2244 can be a computer, a server, a router, anetwork PC, a workstation, a microprocessor based appliance, a peerdevice or other common network node and the like, and typically can alsoinclude many or all of the elements described relative to computer 2212.For purposes of brevity, only a memory storage device 2246 isillustrated with remote computer 2244. Remote computer 2244 can belogically connected to computer 2212 through a network interface 2248and then physically connected via communication connection 2250.Further, operation can be distributed across multiple (local and remote)systems. Network interface 2248 can encompass wire and/or wirelesscommunication networks such as local-area networks (LAN), wide-areanetworks (WAN), cellular networks, etc. LAN technologies include FiberDistributed Data Interface (FDDI), Copper Distributed Data Interface(CDDI), Ethernet, Token Ring and the like. WAN technologies include, butare not limited to, point-to-point links, circuit switching networkslike Integrated Services Digital Networks (ISDN) and variations thereon,packet switching networks, and Digital Subscriber Lines (DSL). One ormore communication connections 2250 refers to the hardware/softwareemployed to connect the network interface 2248 to the system bus 2218.While communication connection 2250 is shown for illustrative clarityinside computer 2212, it can also be external to computer 2212. Thehardware/software for connection to the network interface 2248 can alsoinclude, for exemplary purposes only, internal and external technologiessuch as, modems including regular telephone grade modems, cable modemsand DSL modems, ISDN adapters, and Ethernet cards.

Embodiments of the present invention can be a system, a method, anapparatus and/or a computer program product at any possible technicaldetail level of integration. The computer program product can include acomputer readable storage medium (or media) having computer readableprogram instructions thereon for causing a processor to carry outaspects of the present invention. The computer readable storage mediumcan be a tangible device that can retain and store instructions for useby an instruction execution device. The computer readable storage mediumcan be, for example, but is not limited to, an electronic storagedevice, a magnetic storage device, an optical storage device, anelectromagnetic storage device, a semiconductor storage device, or anysuitable combination of the foregoing. A non-exhaustive list of morespecific examples of the computer readable storage medium can alsoinclude the following: a portable computer diskette, a hard disk, arandom access memory (RAM), a read-only memory (ROM), an erasableprogrammable read-only memory (EPROM or Flash memory), a static randomaccess memory (SRAM), a portable compact disc read-only memory (CD-ROM),a digital versatile disk (DVD), a memory stick, a floppy disk, amechanically encoded device such as punch-cards or raised structures ina groove having instructions recorded thereon, and any suitablecombination of the foregoing. A computer readable storage medium, asused herein, is not to be construed as being transitory signals per se,such as radio waves or other freely propagating electromagnetic waves,electromagnetic waves propagating through a waveguide or othertransmission media (e.g., light pulses passing through a fiber-opticcable), or electrical signals transmitted through a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network can includecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device. Computer readable programinstructions for carrying out operations of various aspects of thepresent invention can be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, configuration data for integrated circuitry, oreither source code or object code written in any combination of one ormore programming languages, including an object oriented programminglanguage such as Smalltalk, C++, or the like, and procedural programminglanguages, such as the “C” programming language or similar programminglanguages. The computer readable program instructions can executeentirely on the user's computer, partly on the user's computer, as astand-alone software package, partly on the user's computer and partlyon a remote computer or entirely on the remote computer or server. Inthe latter scenario, the remote computer can be connected to the user'scomputer through any type of network, including a local area network(LAN) or a wide area network (WAN), or the connection can be made to anexternal computer (for example, through the Internet using an InternetService Provider). In some embodiments, electronic circuitry including,for example, programmable logic circuitry, field-programmable gatearrays (FPGA), or programmable logic arrays (PLA) can execute thecomputer readable program instructions by utilizing state information ofthe computer readable program instructions to customize the electroniccircuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions. These computer readable programinstructions can be provided to a processor of a general purposecomputer, special purpose computer, or other programmable dataprocessing apparatus to produce a machine, such that the instructions,which execute via the processor of the computer or other programmabledata processing apparatus, create means for implementing thefunctions/acts specified in the flowchart and/or block diagram block orblocks. These computer readable program instructions can also be storedin a computer readable storage medium that can direct a computer, aprogrammable data processing apparatus, and/or other devices to functionin a particular manner, such that the computer readable storage mediumhaving instructions stored therein includes an article of manufactureincluding instructions which implement aspects of the function/actspecified in the flowchart and/or block diagram block or blocks. Thecomputer readable program instructions can also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational acts to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram orblocks.

While the subject matter has been described above in the general contextof computer-executable instructions of a computer program product thatruns on a computer and/or computers, those skilled in the art willrecognize that this disclosure also can or can be implemented incombination with other program modules or components. Generally, programmodules or components include routines, programs, components, datastructures, etc. that perform particular tasks and/or implementparticular abstract data types. Moreover, those skilled in the art willappreciate that the inventive computer-implemented methods can bepracticed with other computer system configurations, includingsingle-processor or multiprocessor computer systems, mini-computingdevices, mainframe computers, as well as computers, hand-held computingdevices (e.g., PDA, phone), microprocessor-based or programmableconsumer or industrial electronics, and the like. The illustratedaspects can also be practiced in distributed computing environmentswhere tasks are performed by remote processing devices that are linkedthrough a communications network. However, some, if not all aspects ofthis disclosure can be practiced on stand-alone computers. In adistributed computing environment, program modules or components can belocated in both local and remote memory storage devices.

As used in this application, the terms “component,” “system,”“platform,” “interface,” and the like, can refer to and/or can include acomputer-related entity or an entity related to an operational machinewith one or more specific functionalities. The entities disclosed hereincan be either hardware, a combination of hardware and software,software, or software in execution. For example, a component can be, butis not limited to being, a process running on a processor, a processor,an object, an executable, a thread of execution, a program, and/or acomputer. By way of illustration, both an application running on aserver and the server can be a component. One or more components canreside within a process and/or thread of execution and a component canbe localized on one computer and/or distributed between two or morecomputers. In another example, respective components can execute fromvarious computer readable media having various data structures storedthereon. The components can communicate via local and/or remoteprocesses such as in accordance with a signal having one or more datapackets (e.g., data from one component interacting with anothercomponent in a local system, distributed system, and/or across a networksuch as the Internet with other systems via the signal). As anotherexample, a component can be an apparatus with specific functionalityprovided by mechanical parts operated by electric or electroniccircuitry, which is operated by a software or firmware applicationexecuted by a processor. In such a case, the processor can be internalor external to the apparatus and can execute at least a part of thesoftware or firmware application. As yet another example, a componentcan be an apparatus that provides specific functionality throughelectronic components without mechanical parts, wherein the electroniccomponents can include a processor or other means to execute software orfirmware that confers at least in part the functionality of theelectronic components. In an aspect, a component can emulate anelectronic component via a virtual machine, e.g., within a cloudcomputing system.

In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” That is, unless specified otherwise, or clearfrom context, “X employs A or B” is intended to mean any of the naturalinclusive permutations. That is, if X employs A; X employs B; or Xemploys both A and B, then “X employs A or B” is satisfied under any ofthe foregoing instances. Moreover, articles “a” and “an” as used in thesubject specification and annexed drawings should generally be construedto mean “one or more” unless specified otherwise or clear from contextto be directed to a singular form. As used herein, the terms “example”and/or “exemplary” are utilized to mean serving as an example, instance,or illustration. For the avoidance of doubt, the subject matterdisclosed herein is not limited by such examples. In addition, anyaspect or design described herein as an “example” and/or “exemplary” isnot necessarily to be construed as preferred or advantageous over otheraspects or designs, nor is it meant to preclude equivalent exemplarystructures and techniques known to those of ordinary skill in the art.

As it is employed in the subject specification, the term “processor” canrefer to substantially any computing processing unit or deviceincluding, but not limited to, single-core processors; single-processorswith software multithread execution capability; multi-core processors;multi-core processors with software multithread execution capability;multi-core processors with hardware multithread technology; parallelplatforms; and parallel platforms with distributed shared memory.Additionally, a processor can refer to an integrated circuit, anapplication specific integrated circuit (ASIC), a digital signalprocessor (DSP), a field programmable gate array (FPGA), a programmablelogic controller (PLC), a complex programmable logic device (CPLD), adiscrete gate or transistor logic, discrete hardware components, or anycombination thereof designed to perform the functions described herein.Further, processors can exploit nano-scale architectures such as, butnot limited to, molecular and quantum-dot based transistors, switchesand gates, in order to optimize space usage or enhance performance ofuser equipment. A processor can also be implemented as a combination ofcomputing processing units. In this disclosure, terms such as “store,”“storage,” “data store,” data storage,” “database,” and substantiallyany other information storage component relevant to operation andfunctionality of a component are utilized to refer to “memorycomponents,” entities embodied in a “memory,” or components including amemory. It is to be appreciated that memory and/or memory componentsdescribed herein can be either volatile memory or nonvolatile memory, orcan include both volatile and nonvolatile memory. By way ofillustration, and not limitation, nonvolatile memory can include readonly memory (ROM), programmable ROM (PROM), electrically programmableROM (EPROM), electrically erasable ROM (EEPROM), flash memory, ornonvolatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM).Volatile memory can include RAM, which can act as external cache memory,for example. By way of illustration and not limitation, RAM is availablein many forms such as synchronous RAM (SRAM), dynamic RAM (DRAM),synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhancedSDRAM (ESDRAM), Synchlink DRAM (SLDRAM), direct Rambus RAM (DRRAM),direct Rambus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM).Additionally, the disclosed memory components of systems orcomputer-implemented methods herein are intended to include, withoutbeing limited to including, these and any other suitable types ofmemory.

What has been described above include mere examples of systems, computerprogram products and computer-implemented methods. It is, of course, notpossible to describe every conceivable combination of components,products and/or computer-implemented methods for purposes of describingthis disclosure, but one of ordinary skill in the art can recognize thatmany further combinations and permutations of this disclosure arepossible. Furthermore, to the extent that the terms “includes,” “has,”“possesses,” and the like are used in the detailed description, claims,appendices and drawings such terms are intended to be inclusive in amanner similar to the term “comprising” as “comprising” is interpretedwhen employed as a transitional word in a claim. The descriptions of thevarious embodiments have been presented for purposes of illustration,but are not intended to be exhaustive or limited to the embodimentsdisclosed. Many modifications and variations will be apparent to thoseof ordinary skill in the art without departing from the scope and spiritof the described embodiments. The terminology used herein was chosen tobest explain the principles of the embodiments, the practicalapplication or technical improvement over technologies found in themarketplace, or to enable others of ordinary skill in the art tounderstand the embodiments disclosed herein.

What is claimed is:
 1. A method of fabricating a sensor for static anddynamic body measurements, comprising: providing a first layer servingas a flexible support material; disposing a second layer on the firstlayer, the second layer serving as a sensing material; disposing a thirdlayer on the second layer, the third layer comprising an insulatingmaterial; coupling the second layer and the third layer using a firstelectrode comprising a first conductive thread and a firstnon-conductive thread, the first conductive thread embedded in thesecond layer, wherein the first conductive thread and the firstnon-conductive thread are used together in a spool, sewing needle, topthread, bobbin, and/or combinations thereof to form the first electrode;and coupling the first layer and the second layer using a secondelectrode comprising a second conductive thread and a secondnon-conductive thread, the second conductive thread embedded in thesecond layer, wherein the second conductive thread and the secondnon-conductive thread are used together in a spool, sewing needle, topthread, bobbin, and/or combinations thereof to form the secondelectrode.
 2. The method of claim 1, wherein the sensor is a firstsensor, and wherein the method further comprises fabricating a secondsensor spaced laterally from the first sensor along a common horizontalaxis or a common vertical axis by steps: disposing a fourth layer on thefirst layer, the fourth layer serving as a second sensing material;disposing the third layer on the fourth layer, the third layercomprising the insulating material; coupling the fourth layer and thethird layer using a third electrode comprising a third conductive threadand a third non-conductive thread, the third conductive thread embeddedin the fourth layer; and coupling the fourth layer and the first layerusing a fourth electrode comprising a fourth conductive thread, thefourth conductive thread embedded in the fourth layer.
 3. The method ofclaim 1, wherein the first electrode comprising the first conductivethread and the first non-conductive thread, and the second electrodecomprising the second conductive thread and the second non-conductivethread, are couple by the first layer and the second layer, wherein thefirst conductive thread and the second conductive thread are embedded inthe second layer, and wherein the first non-conductive thread and thesecond non-conductive thread are embedded in the first layer.
 4. Themethod of claim 1, wherein the first electrode comprising the firstconductive thread and the first non-conductive thread, and the secondelectrode comprising the second conductive thread and the secondnon-conductive thread are couple by the third layer and the secondlayer, wherein the first conductive thread and the second conductivethread are embedded in the second layer, and wherein the firstnon-conductive thread and the second non-conductive thread are embeddedin the third layer.
 5. The method of claim 1, further comprising:configuring, (i) a cross-sectional shape of the first electrode or thesecond electrode, or (ii) a spacing between two or more of the firstelectrode and the second electrode, to alter a response time, an inputdynamic range, an output dynamic range, and/or a sensitivity of thesensor.
 6. The method of claim 1, wherein the sensor is a first sensor,and wherein the first electrode (electrode 1) of the first sensor isconnected with a second sensor with an electrode 2 by: bonding theelectrode 1 with the electrode 2 with conductive epoxy, spray, paint, ora conductively doped adhesive material.
 7. The method of claim 1,wherein the sensor is a first sensor, and wherein the first electrode(electrode 1) of the first sensor is connected with a second sensor withan electrode 2 by: terminating the electrode 1 with a conductiveterminal attached to a conductive wire, thread, material, and/orcombinations thereof, that is used to overlap with the electrode
 2. 8.The method of claim 1, wherein the sensor is a first sensor, and whereinthe first electrode (electrode 1) of the first sensor is connected witha second sensor with an electrode 2 by: terminating both the electrode 1and the electrode 2 with a conductive terminal that is connectedtogether physically, magnetically, and/or combinations thereof.
 9. Themethod of claim 1, wherein the sensor is a first sensor, and wherein thefirst electrode (electrode 1) of the first sensor is connected with asecond sensor with an electrode 2 by: overlapping the ends of theelectrode 1 of the first sensor with the electrode 2 of the secondsensor using a third conductive material to overlap the ends of theelectrode 1 with the electrode
 2. 10. The method of claim 9, wherein theoverlap of electrode 1 and electrode 2 is achieved using manual,mechanical, electrical, computerized, embroidery stitches, threading,and/or combinations thereof.
 11. The method of claim 9, wherein theoverlap of the electrode 1 and the electrode 2 is achieved by usingresins, sprays, paints, epoxies, and/or combinations thereof to bond theelectrode 1 with the electrode 2 with a conductively doped adhesive. 12.The method of claim 9, wherein the overlap of the electrode 1 and theelectrode 2 is achieved by using a conductive terminal, a magneticterminal, and/or combinations thereof.
 13. The method of claim 1,wherein the first electrode comprises: at least one conductive thread,wherein the at least one conductive thread is one or more ply perconductive thread, and at least one non-conductive thread, wherein theat least one non-conductive thread is one or more ply per non-conductivethread, wherein the at least one conductive thread and the at least onenon-conductive thread are interlaced when embedded in a given layer,wherein the at least one conductive thread or the at least onenon-conductive thread are separately exposed on a front or a back of thegiven layer, or exposed on a same side of the given layer, and whereinthe at least one conductive thread or the at least one non-conductivethread is patterned to a shape or an area of a corresponding conductiveor non-conductive layer.
 14. The method of claim 1, wherein the first orthe second conductive thread comprises a dopant selected from the groupconsisting of a group I element, a group II element, a transition metal,a group III element, a group IV element, a group V element, a group VIelement, a group VII element, and combinations thereof.
 15. The methodof claim 1, wherein a tension between the first or the second conductivethread and the first or the second non-conductive thread is configuredto alter a tensile strength, a stability, a texture, an elasticity,and/or a friability of the first electrode or the second electrode. 16.The method of claim 1, wherein altering an exposed length between thenon-conductive to conductive segments within the sensing material incoupled layer(s) is configured to alter a conductivity and/or asensitivity of the first electrode or the second electrode.
 17. Themethod of claim 1, wherein (i) a dopant, (ii) a ply count, and/or (iii)a thread pattern density, is configured to alter a conductivity and/or asensitivity of the first electrode or the second electrode.
 18. Themethod of claim 1, wherein the first layer, the second layer, the thirdlayer, the first electrode, and/or the second electrode can be furtherfabricated or modified using electrospinning/spraying, spray painting,and combinations thereof.
 19. A method of fabricating a sensor,comprising: providing a first layer serving as a flexible supportmaterial; disposing a second layer on the first layer, the second layerserving as a sensing material; disposing a third layer on the secondlayer, the third layer comprising an insulating material; coupling thesecond layer and the third layer using a first electrode comprising afirst conductive thread and a first non-conductive thread, the firstconductive thread embedded in the second layer; and coupling the firstlayer and the second layer using a second electrode comprising a secondconductive thread and a second non-conductive thread, the secondconductive thread embedded in the second layer, wherein altering anexposed length between non-conductive to conductive segments of thefirst electrode or the second electrode within the sensing material incoupled layer(s) is adapted to alter a conductivity and/or a sensitivityof the first electrode or the second electrode.
 20. The method of claim19, wherein the first conductive thread and the first non-conductivethread are used together in a spool, sewing needle, top thread, bobbin,and/or combinations thereof to form the first electrode, and wherein thesecond conductive thread and the second non-conductive thread are usedtogether in a spool, sewing needle, top thread, bobbin, and/orcombinations thereof to form the second electrode.